利用Na2WO4-WO3熔盐体系在V-4Cr-4Ti合金基体上电沉积制备了金属W涂层,在电流密度为10-160 mA/cm2范围内研究了电流密度对金属W涂层的显微结构和力学性能的影响.研究结果表明,增大电流密度促进了W晶核的生长以及晶粒尺寸的增大.W原子更容易在V-4Cr-4Ti合金基体上形核,而在初始W晶核上继续沉积主要是W晶核长大的过程,电流密度较大(100 mA/cm2)时,W涂层的金相组织呈柱状和条状结构,电流密度较小时,W涂层组织呈牙柱状.W涂层的硬度随着电流密度的增加而下降,W涂层与V-4Cr-4Ti合金基体的结合强度超过59.36 MPa.电流密度为10 mA/cm2时,虽然涂层厚度仅有10 μm,但W涂层晶粒尺寸小于5 μm,涂层硬度、电流效率以及涂层和基体的结合力达到最大值,分别为628.42 HV,99.71％和96 N.
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