利用直流复合电镀方法将WC纳米颗粒均匀分散到Ni镀层,用微米压痕仪测试了镀层的力学性能,用动电位极化曲线研究了镀层在pH=9.0的0.05 mol/L H3BO3+ 0.075 mol/L Na2B4O7缓冲溶液中的电化学性能.结果表明,与纯Ni镀层相比,纳米复合镀层的晶粒尺寸显著减小,约为21 nm;硬度提高了81％,达到651HV;自腐蚀电流密度降低约一个数量级,约为1.29×10-7A/cm2;破钝电位基本一致,但致钝电位(10 mV)更低,维钝电流密度(1.79×10 6 A/cm2)更小,仅为纯Ni镀层的1/7.利用Mott-Schottky理论结合点缺陷模型分析表明:表面钝化膜仍具有p型半导体特征,WC纳米颗粒显著降低基体Ni的晶粒尺寸,引起钝化膜中点缺陷密度和扩散系数的降低.
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