实现了二维C/SiC与Nb合金NbHf10-1M的可靠连接. 连接时将Ti-Cu核心中间层与Cu辅助中间层构成的叠层结构置于C/SiC与Nb合金之间, 并采用了固相扩散连接与瞬间液相扩散连接(Transient liquid phase-diffusion bonding, TLP-DB)相结合的连接方法. 结果表明: 辅助中间层厚度>0.72mm时, 可以有效缓解接头热应力. 核心中间层在TLP-DB过程中形成的液相对C/SiC具有良好浸润性, 可渗入C/SiC基体, 并包裹位于核心中间层与C/SiC界面区域的C纤维. 接头剪切强度最高为14.1MPa.
2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface.
The highest shear stress of joint is 14.1 MPa.
参考文献
| [1] | Naslain R. Composites Science and Technology, 2004, 64: 155--170. [2] Besmann T M, Sheldon B W, Lowden R A. Science, 1991, 253: 1104--1109. [3] Ishikawa T, Kajii S, Matsanaga K, et al. Science, 1998, 282: 1295--1297. [4] Xu Y D, Cheng L F, Zhang L T, et al. Mater. Sci. Eng. A, 2001, 300: 196--201. [5] 肖鹏, 许永东, 张立同, 等(XIAO Peng, et al). 无机材料学报 (Journal of Inorganic Materials), 2000, 15(5): 903--908. [6] Wulz H G, Stark H, Trabandt U. AIAA-2000-2435: 1--9. [7] Kurumada A, McEnaney B, Oku T, et al. J. Nucl. Mater., 1996, 240: 43--50. [8] Kurumada A, Oku T, Imamura Y, et al. J. Nucl. Mater., 1998, 258-263: 821--827. [9] 童巧英, 成来飞, 张立同. 航空材料学报, 2004, 24(1): 53--56. [10] NASA 1999 SBIR Phase I Proposal Number: 99-1 03.07--4242. [11] Gorsse S, Petitcorps Y L. Composites Part A, 1998, 29: 1221--1227. [12] Liu H J, Feng J C, Qian Y Y. Scripta Mater., 2000, 43: 49--53. |
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