用传统固相法制备了(1-x)BaTiO3/xCu(x=5 wt%,10 wt%,15 wt%,20 wt%,25 wt%,30 wt%)复相陶瓷,研究了Cu含量对复相陶瓷材料的显微结构、渗流阈值及介电性能的影响.研究结果表明:BaTiO3/Cu复相陶瓷材料的电阻率随着铜含量的增加而下降,且在渗流阈值(x=25wt%)附近呈现非线性的下降趋势,复合材料从绝缘体逐渐变为导体.室温下1 kHz当Cu含量达到x=30wt%时复相陶瓷的介电常数为～9000,这是由于在导体和绝缘体的相界面处积累大量的空间电荷,并由此产生界面极化,导致介电常数的显著增大,且随着导体含量的增加,这种界面效应更加明显.复相陶瓷的介电损耗随着铜含量的增加而增大,但随着频率的升高,由于空间电荷的减少又会使损耗呈现下降的趋势.在25～115℃的温度范围内,复相陶瓷温度系数小于5%.具有很高的介电常数温度稳定性.
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