{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"利用磁控溅射方法及微细加工技术制备了弯曲型三明治结构的<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>多层膜,在频率1～40MHz下研究了多层膜的纵向和横向巨磁阻抗效应,结果表明弯曲型三明治结构多层膜的巨磁阻抗效应高于它的传统的多层膜.在频率10MHz、磁场11.94kA/m下巨磁阻抗效应达-50%.","authors":[{"authorName":"张亚民","id":"2f9475ed-fe13-4d39-8d16-0b9a72499285","originalAuthorName":"张亚民"},{"authorName":"陈吉安","id":"93face7a-7df4-4bed-8e28-c98ff224bd59","originalAuthorName":"陈吉安"},{"authorName":"丁文","id":"de706327-d0b7-422f-8bb1-d3e9325c1eec","originalAuthorName":"丁文"},{"authorName":"周勇","id":"eb470847-0c0c-4cb0-95b8-40b0745c2e50","originalAuthorName":"周勇"},{"authorName":"王明军","id":"5dbd3c8e-1760-424a-8221-19671dda2ed1","originalAuthorName":"王明军"},{"authorName":"高孝裕","id":"aab8dff5-fa87-46fd-9c7b-c40bf30246f9","originalAuthorName":"高孝裕"},{"authorName":"周志敏","id":"deab4810-f84b-4447-83ae-3a23c3a80dfa","originalAuthorName":"周志敏"}],"doi":"","fpage":"838","id":"ea05e93f-ea03-46e2-960b-9440dfc00d52","issue":"6","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"35057c1f-0cc7-4cdb-a8af-0a4668740980","keyword":"巨磁阻抗","originalKeyword":"巨磁阻抗"},{"id":"1ff0fd83-afc5-4bef-8ef1-2d500f0e4d2d","keyword":"<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>","originalKeyword":"FeCuNbCrSiB/Cu/FeCuNbCrSiB"},{"id":"122340fa-92e1-46a5-a515-b8ac9a20aafb","keyword":"三明治薄膜","originalKeyword":"三明治薄膜"},{"id":"38c29a12-2542-42c6-ba88-567b1c693111","keyword":"弯曲型结构","originalKeyword":"弯曲型结构"},{"id":"0bafb594-6d0c-4c92-9741-dae41c5961fe","keyword":"微细加工","originalKeyword":"微细加工"}],"language":"zh","publisherId":"gncl200506010","title":"弯曲型三明治结构<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>多层膜巨磁阻抗效应研究","volume":"36","year":"2005"},{"abstractinfo":"基于MEMS微细加工工艺,利用磁控溅射方法在Si基片上制备了不同<span style=\"color:red\">Cu</span>层宽度弯曲型三明治结构的<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>多层膜,在频率1～40MHz下研究了<span style=\"color:red\">Cu</span>层宽度对多层膜的应力阻抗效应的影响.结果表明,弯曲型三明治结构多层膜的应力阻抗(SJ)效应随<span style=\"color:red\">Cu</span>层宽度的变化有明显的变化,在频率5MHz、基片自由端在y轴方向偏移的距离h为1500μm时,当<span style=\"color:red\">Cu</span>层宽度为0.4mm时,应力阻抗效应达-25%左右.","authors":[{"authorName":"陈吉安","id":"12864322-4f78-4289-ad89-0cbf207fbe65","originalAuthorName":"陈吉安"},{"authorName":"张亚民","id":"0b663c4b-cb18-4e4e-b23b-713b18d27224","originalAuthorName":"张亚民"},{"authorName":"赵晓昱","id":"f0bcb882-4f7b-4ebf-a654-b923e2a4b7db","originalAuthorName":"赵晓昱"},{"authorName":"周勇","id":"fccc09e2-c881-44e8-884f-eb2552b85d4f","originalAuthorName":"周勇"},{"authorName":"周志敏","id":"89bf781d-199f-4e67-b0fa-98567fa8de06","originalAuthorName":"周志敏"},{"authorName":"王明军","id":"6bf59138-d168-40f1-b864-2aa8d53e6819","originalAuthorName":"王明军"},{"authorName":"高孝裕","id":"5fbce213-9e59-458e-96cb-3ef8fe27db59","originalAuthorName":"高孝裕"}],"doi":"10.3969/j.issn.1005-8192.2005.03.003","fpage":"9","id":"30729e99-50f8-4504-ac31-4885d9cea0da","issue":"3","journal":{"abbrevTitle":"JSGNCL","coverImgSrc":"journal/img/cover/JSGNCL.jpg","id":"46","issnPpub":"1005-8192","publisherId":"JSGNCL","title":"金属功能材料"},"keywords":[{"id":"7327d8d0-d46f-43bf-8147-9d25f3f08661","keyword":"应力阻抗","originalKeyword":"应力阻抗"},{"id":"58ab0d8c-dae4-4f09-a982-0c790b8162ec","keyword":"<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>","originalKeyword":"FeCuNbCrSiB/Cu/FeCuNbCrSiB"},{"id":"bc379692-45d1-4259-8685-43c7e00af0c7","keyword":"三明治薄膜","originalKeyword":"三明治薄膜"},{"id":"fa7f5627-86f9-49c8-9235-21ef9a0b32ed","keyword":"弯曲型结构","originalKeyword":"弯曲型结构"},{"id":"ef37da37-b8cf-41fc-8bd5-7cde4afb9267","keyword":"微细加工","originalKeyword":"微细加工"}],"language":"zh","publisherId":"jsgncl200503003","title":"<span style=\"color:red\">Cu</span>层宽度对弯曲型三明治结构<span style=\"color:red\">FeCuNbCrSiB</span>/<span style=\"color:red\">Cu</span>/<span style=\"color:red\">FeCuNbCrSiB</span>多层膜应力阻抗效应的影响","volume":"12","year":"2005"},{"abstractinfo":"对Fe68 <span style=\"color:red\">Cu</span>1 Nb3Cr8Si10 B10非晶合金在400～540℃等温退火lh后的晶化行为及初始磁导率μi与温度的关系进行了研究.结果表明:用Cr取代部分Fe和Si的Fe68<span style=\"color:red\">Cu</span>1Nb3Cr8Si10B10非晶合金经适当温度退火后可获得具有bcc结构的α-Fe(Si)纳米晶,合金的居里温度(Tc＜150℃)远低于Finemet合金的Tc(约为340℃);合金在淬态和400℃退火后的μi-T曲线上出现H0pinson峰,经500℃和540℃退火后其μi-T曲线上Hop-kinson峰消失,曲线具有明显的长尾特征.","authors":[{"authorName":"赵玉华","id":"d690ad59-9f42-46e2-9c0e-8d1f0b9431df","originalAuthorName":"赵玉华"},{"authorName":"何开元","id":"c006bf7d-72a1-4ffc-adb7-7f8c71b1e2e6","originalAuthorName":"何开元"},{"authorName":"赵恒和","id":"160ced7a-cfe1-4c2d-93d5-133ff71aaa76","originalAuthorName":"赵恒和"},{"authorName":"程力智","id":"8b9f847a-d57e-4f23-bcb5-8a1aa655e6e5","originalAuthorName":"程力智"}],"doi":"","fpage":"503","id":"b91deb75-5e73-4208-8811-36a0fce1e4a6","issue":"5","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"68a8b93a-c605-4362-8f2c-d54d96b0728f","keyword":"Fes8<span style=\"color:red\">Cu</span>1Nb3Cr8Si10B10非晶合金","originalKeyword":"Fes8Cu1Nb3Cr8Si10B10非晶合金"},{"id":"d71441d9-bd17-42f9-ad73-f61355bf2453","keyword":"纳米晶化","originalKeyword":"纳米晶化"},{"id":"0399c1f9-d201-4a3d-8ba2-457707f74cee","keyword":"初始磁导率","originalKeyword":"初始磁导率"},{"id":"bf1fb868-4a07-4e9e-81c5-a49278edc6f8","keyword":"居里温度","originalKeyword":"居里温度"}],"language":"zh","publisherId":"gncl200205017","title":"<span style=\"color:red\">FeCuNbCrSiB</span>非晶合金的晶化及磁导率与温度的关系","volume":"33","year":"2002"},{"abstractinfo":"Some information on how to use in-situ determined diffusion coefficient of <span style=\"color:red\">Cu</span> to make barrier layer of <span style=\"color:red\">Cu</span> metallization in ultra large scale integrations (ULSIs) was provided. Diffusion coefficients of <span style=\"color:red\">Cu</span> in Co at low temperature were determined to analyze <span style=\"color:red\">Cu</span> migration to Co surface layer. The diffusion depths were analyzed using X-ray photoelectron spectroscopy (XPS) depth profile to investigate the diffusion effect of <span style=\"color:red\">Cu</span> in Co at different temperatures. The possible pretreatment temperature and time of barrier layer can be predicted according to the diffusion coefficients of <span style=\"color:red\">Cu</span> in Co.","authors":[{"authorName":"Xiuhua CHEN","id":"5e97980f-6dfd-41a3-82be-3d406b6f86c1","originalAuthorName":"Xiuhua CHEN"}],"categoryName":"|","doi":"","fpage":"342","id":"a4b439a1-8c5f-4189-a99d-1944d8e9c5f0","issue":"3","journal":{"abbrevTitle":"CLKXJSY","coverImgSrc":"journal/img/cover/JMST.jpg","id":"11","issnPpub":"1005-0302 ","publisherId":"CLKXJSY","title":"材料科学技术（英文）"},"keywords":[{"id":"2fbe3b18-0d2b-4712-8ca3-56a3d6335ee6","keyword":"<span style=\"color:red\">Cu</span> diffusion","originalKeyword":"Cu diffusion"},{"id":"80ee3adb-550e-4651-a8e3-1e172614d713","keyword":"null","originalKeyword":"null"},{"id":"11403824-720d-42cf-bf8e-f97e9ace6f37","keyword":"null","originalKeyword":"null"},{"id":"d9fd309b-608d-4b4a-998e-a599d263fb30","keyword":"null","originalKeyword":"null"}],"language":"en","publisherId":"1005-0302_2006_3_9","title":"<span style=\"color:red\">Cu</span> Diffusion in Co/<span style=\"color:red\">Cu</span>/TiN Films for <span style=\"color:red\">Cu</span> Metallization","volume":"22","year":"2006"},{"abstractinfo":"A comprehensive transmission electron microscopy (TEM) study was conducted to investigate the growth mechanisms Of <span style=\"color:red\">Cu</span>(3)Sn on polycrystalline and single crystalline <span style=\"color:red\">Cu</span> substrates in solder joints. On single crystalline <span style=\"color:red\">Cu</span> the solder reflow process resulted in the growth of columnar <span style=\"color:red\">Cu</span>(3)Sn grains aligned in a thin uniform layer perpendicular to the interface, while a thick <span style=\"color:red\">Cu</span>(3)Sn layer formed from fine equiaxed grains on the polycrystalline substrate. In the subsequent solid state aging, columnar growth Of <span style=\"color:red\">Cu</span>(3)Sn continued on the single crystalline <span style=\"color:red\">Cu</span> before it was replaced by nucleation and growth of new triangular <span style=\"color:red\">Cu</span>(3)Sn grains at the triple junction sites of the <span style=\"color:red\">Cu</span>/<span style=\"color:red\">Cu</span>(3)Sn interface. On the polycrystalline <span style=\"color:red\">Cu</span> the solid state aging caused much more rapid growth of the <span style=\"color:red\">Cu</span>(3)Sn layer due to nucleation and the growth of new <span style=\"color:red\">Cu</span>(3)Sn grains at both the <span style=\"color:red\">Cu</span>/<span style=\"color:red\">Cu</span>(3)Sn and <span style=\"color:red\">Cu</span>(6)Sn(5)/<span style=\"color:red\">Cu</span>(3)Sn interfaces. These different growth behaviors Of <span style=\"color:red\">Cu</span>(3)Sn were related to the diffusive supply of reactive elements. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.","authors":[],"categoryName":"|","doi":"","fpage":"4697","id":"0d2b5d7e-d582-4909-baf1-ed9c8ded31cd","issue":"16","journal":{"abbrevTitle":"AM","id":"473e1d60-024a-4fd2-8f59-9e3ede87721e","issnPpub":"1359-6454","publisherId":"AM","title":"Acta Materialia"},"keywords":[{"id":"6439d6b1-2ff4-4fe0-97e1-37f64f1792d4","keyword":"<span style=\"color:red\">Cu</span>(3)Sn;Growth mechanism;Interface;Soldering;Transmission electron;microscopy;solder joints;interfacial reactions;intermetallic growth;reactive;interface;diffusion couples;molten sn;temperature;technology;copper;layers","originalKeyword":"Cu(3)Sn;Growth mechanism;Interface;Soldering;Transmission electron;microscopy;solder joints;interfacial reactions;intermetallic growth;reactive;interface;diffusion couples;molten sn;temperature;technology;copper;layers"}],"language":"en","publisherId":"1359-6454_2009_16_2","title":"Growth mechanisms of <span style=\"color:red\">Cu</span>(3)Sn on polycrystalline and single crystalline <span style=\"color:red\">Cu</span> substrates","volume":"57","year":"2009"},{"abstractinfo":"对大变形制备的<span style=\"color:red\">Cu</span>-Cr原位复合材料的相界面进行HRTEM分析.结果表明:在<span style=\"color:red\">Cu</span>/<span style=\"color:red\">Cu</span>界面观察到两种界面衬度,即完全共格和错配位错衬度；<span style=\"color:red\">Cu</span>/Cr界面观察到完全共格和波纹图衬度.且发现在应变量η=6.43时,<span style=\"color:red\">Cu</span>/Cr界面中的Cr侧通过晶内畸变位错调节与基体的应变差异,保持界面的共格状态.","authors":[{"authorName":"陈小红","id":"9bcf85f6-0c7d-4ef4-bc8c-8d5d9d66971d","originalAuthorName":"陈小红"},{"authorName":"刘平","id":"f93c67e2-7eab-4835-86ac-e204c43a7fae","originalAuthorName":"刘平"},{"authorName":"毕莉明","id":"6d564512-ce95-4d3a-ae14-cc5747a9453d","originalAuthorName":"毕莉明"},{"authorName":"简发萍","id":"b7afc380-bac4-4f42-ad34-72b85921907b","originalAuthorName":"简发萍"},{"authorName":"刘新宽","id":"dc42c60f-3f67-4795-b0e0-58d139f1c896","originalAuthorName":"刘新宽"},{"authorName":"马凤仓","id":"d89fc98b-f6dd-4feb-9612-61bbf4fd972b","originalAuthorName":"马凤仓"},{"authorName":"李伟","id":"9f30a117-94ef-4bcf-be4a-e369288f561b","originalAuthorName":"李伟"}],"doi":"","fpage":"11","id":"c56fe7be-bae0-40e7-b08e-3e2d7a15ebf8","issue":"1","journal":{"abbrevTitle":"CLRCLXB","coverImgSrc":"journal/img/cover/CLRCLXB.jpg","id":"15","issnPpub":"1009-6264","publisherId":"CLRCLXB","title":"材料热处理学报"},"keywords":[{"id":"936eb6ff-da59-4ca5-8b82-e6fd62c99cea","keyword":"<span style=\"color:red\">Cu</span>-Cr原位复合材料","originalKeyword":"Cu-Cr原位复合材料"},{"id":"e83dc887-5767-4b18-ba7c-1554544f758b","keyword":"相界面","originalKeyword":"相界面"},{"id":"5648a7db-7374-457f-905a-4aceab38e3fe","keyword":"HRTEM","originalKeyword":"HRTEM"}],"language":"zh","publisherId":"jsrclxb201301003","title":"<span style=\"color:red\">Cu</span>-Cr原位复合材料中<span style=\"color:red\">Cu</span>/<span style=\"color:red\">Cu</span>、<span style=\"color:red\">Cu</span>/Cr界面HRTEM分析","volume":"34","year":"2013"},{"abstractinfo":"用爆炸复合的方法,试制出了<span style=\"color:red\">Cu</span>/Mo/<span style=\"color:red\">Cu</span>板材.用光学显微镜和扫描电镜研究了其界面组织特征; 并利用显微硬度考察了界面附近硬度及界面附近的形变特点.结果表明:<span style=\"color:red\">Cu</span>/Mo/<span style=\"color:red\">Cu</span>复合材具有波形结合面和平直结合面;波形界面存在熔区,其熔区的显微硬度高于<span style=\"color:red\">Cu</span>基体而低于Mo基体.","authors":[{"authorName":"杨杨","id":"c68c6068-1064-4bd6-9593-43838b0c01e3","originalAuthorName":"杨杨"},{"authorName":"李正华","id":"c2fa7752-52e4-41bf-a021-6e177243e7ca","originalAuthorName":"李正华"},{"authorName":"程信林","id":"a23542ec-aaf2-4d20-9324-6c0cb8871531","originalAuthorName":"程信林"},{"authorName":"朱筱北","id":"0d30d379-687c-4db6-9fdf-75aa22da8121","originalAuthorName":"朱筱北"},{"authorName":"裴大荣","id":"0d14f99b-0dba-4b81-b530-e559984b1497","originalAuthorName":"裴大荣"},{"authorName":"高文柱","id":"5fe2ff98-7d2a-493b-bb25-d78d84ce6cc4","originalAuthorName":"高文柱"}],"doi":"","fpage":"339","id":"6745f569-55fe-4821-a0b7-68e5ec25da8e","issue":"5","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"397d9f4d-5460-4cf9-8716-64fea4e1af66","keyword":"<span style=\"color:red\">Cu</span>/Mo/<span style=\"color:red\">Cu</span>","originalKeyword":"Cu/Mo/Cu"},{"id":"88d93ad2-0bf1-4a5b-9ca8-88cc23b81fbf","keyword":"界面","originalKeyword":"界面"},{"id":"0ead669c-8342-408c-b5ea-4e9b8ade4c42","keyword":"爆炸复合","originalKeyword":"爆炸复合"},{"id":"c5c54cbd-b434-4098-975c-8e55d9b052a6","keyword":"组织特征","originalKeyword":"组织特征"}],"language":"zh","publisherId":"xyjsclygc200105005","title":"<span style=\"color:red\">Cu</span>/Mo/<span style=\"color:red\">Cu</span>爆炸复合界面组织特征","volume":"30","year":"2001"},{"abstractinfo":"The Porous materials of <span style=\"color:red\">Cu</span> and Ag/CLI were successfully prepared by the electrodeposition on a precursor of conventional polyamide foam. The microstructure of the porous materials was observed by scanning electron microscope. Their porosity and specific Surface area were measured. The inhibition effect of <span style=\"color:red\">Cu</span> porous materials against E. coli was also investigated. The broad-spectrum of antibiosis of the <span style=\"color:red\">Cu</span> and Ag/<span style=\"color:red\">Cu</span> porous materials were characterized. The corrosion resistance of <span style=\"color:red\">Cu</span>, Ag/CLI coatings was also compared. The shape and size of pores are uniform in three directions for the porous materials. Their porosity may reach above 95%, and specific Surface area is beyond 12.8 m(2)/m(3). The antibacterial test results show that the <span style=\"color:red\">Cu</span> porous materials not only exhibited high antibacterial effect and good broad-spectrum antibacterial properties, but also excellent persistent antibacterial effects; the antibacterial effects, and broad-spectrum of antibiosis were greatly improved through the deposition of a thin Ag coating on the surface of <span style=\"color:red\">Cu</span> porous material. (C) 2007 Wiley Periodicals, Inc.","authors":[],"categoryName":"|","doi":"","fpage":"33","id":"333e5a6f-03f8-4795-bdc1-6af6748e766a","issue":"1","journal":{"abbrevTitle":"JOBMRPA","id":"097c9456-5c43-4a4c-a09c-ab33bbd6c195","issnPpub":"1549-3296","publisherId":"JOBMRPA","title":"Journal of Biomedical Materials Research Part A"},"keywords":[{"id":"55d28084-552e-41cb-a837-57016cf01656","keyword":"porous material;antibacterial properties;<span style=\"color:red\">Cu</span>;Ag/<span style=\"color:red\">Cu</span>;corrosion;resistance;silver ions;catheter;behavior;copper","originalKeyword":"porous material;antibacterial properties;Cu;Ag/Cu;corrosion;resistance;silver ions;catheter;behavior;copper"}],"language":"en","publisherId":"1549-3296_2008_1_1","title":"Antibacterial properties and corrosion resistance of <span style=\"color:red\">Cu</span> and Ag/<span style=\"color:red\">Cu</span> porous materials","volume":"87A","year":"2008"},{"abstractinfo":"概述了含有可溶性<span style=\"color:red\">Cu</span>化合物和Pd化合物等组成的<span style=\"color:red\">Cu</span>-Pd合金镀液,可以获得耐蚀性和均镀能力优良的光亮<span style=\"color:red\">Cu</span>-Pd合金镀层,适用于装饰物品的表面精饰或者基底镀层.","authors":[{"authorName":"蔡积庆","id":"ac14916a-d63a-41ea-b40a-9f161931a7c8","originalAuthorName":"蔡积庆"}],"doi":"10.3969/j.issn.1005-748X.2000.03.012","fpage":"129","id":"32af1c76-a20f-4733-89a4-ef8a5a78379c","issue":"3","journal":{"abbrevTitle":"FSYFH","coverImgSrc":"journal/img/cover/FSYFH.jpg","id":"25","issnPpub":"1005-748X","publisherId":"FSYFH","title":"腐蚀与防护"},"keywords":[{"id":"9ec08099-971f-4b41-b77d-0e0156452a32","keyword":"<span style=\"color:red\">Cu</span>-Pd合金","originalKeyword":"Cu-Pd合金"},{"id":"d2bab729-336a-4143-bc40-f334ecb5a04c","keyword":"非过敏性金属镀层","originalKeyword":"非过敏性金属镀层"},{"id":"a23b438b-7b6a-480a-9330-2c2f49a64156","keyword":"装饰品","originalKeyword":"装饰品"}],"language":"zh","publisherId":"fsyfh200003012","title":"<span style=\"color:red\">Cu</span>-Pd合金电镀","volume":"21","year":"2000"},{"abstractinfo":"Multilayered <span style=\"color:red\">Cu</span> coatings were successfully obtained by introducing periodic ultrasonic agitation into an ordinary electroplating process. A so-called bidirectional bending test technique was proposed to assess the adhesive performance of electroplated <span style=\"color:red\">Cu</span> coatings to a substrate, in which the coated sample was bent in two directions, while the changes in the coating surface were observed. The critical cycle number for the sample, which corresponds to the start of detachment of the coating from the substrate, proved to be suitable for assessing the adhesion. A comparative study showed that the multilayered <span style=\"color:red\">Cu</span> coatings produced in this work, had much better adhesion than did ordinary <span style=\"color:red\">Cu</span> coatings. (C) Koninklijke Brill NV, Leiden, 2012","authors":[],"categoryName":"|","doi":"","fpage":"1645","id":"8b3a4a6d-8f61-4679-9f3b-6ef1ca9f28ee","issue":"43019","journal":{"abbrevTitle":"JOASAT","id":"43e19d2d-7e2a-4385-8dee-20b151cba5e0","issnPpub":"0169-4243","publisherId":"JOASAT","title":"Journal of Adhesion Science and Technology"},"keywords":[{"id":"0d0a0ccc-a218-4859-86fc-15f86a706009","keyword":"Multilayered <span style=\"color:red\">Cu</span> coatings;adhesion performance;bidirectional bend test;periodic ultrasonic wave;the critical cycle number;single","originalKeyword":"Multilayered Cu coatings;adhesion performance;bidirectional bend test;periodic ultrasonic wave;the critical cycle number;single"}],"language":"en","publisherId":"0169-4243_2012_43019_1","title":"Assessment of Adhesion of Electroplated <span style=\"color:red\">Cu</span> and Multilayered <span style=\"color:red\">Cu</span> Coatings by a Bidirectional Bend Test","volume":"26","year":"2012"}],"totalpage":1077,"totalrecord":10765}