以铜氨离子为铜源,水合肼为还原剂,在表面预氧化的SiC表面,采用一步原位化学沉积法制备了均匀包裹Cu颗粒的SiC复合粉体.采用扫描电子显微镜(SEM)、X射线衍射(XRD)、傅立叶红外光谱(FT-IR)、Zeta电位等测试表征手段研究了工艺条件对原位沉积反应的影响.研究发现SiC表面预氧化形成的SiO2层能显著增强对铜氨离子吸附能力,有助于原位还原生成单质Cu,形成近乎连续包裹层.控制反应体系中铜氨离子浓度和反应温度可以影响反应速率,从而控制Cu颗粒的沉积速率和包裹效果.对比研究表明,在0.2 mol/L铜氨离子溶液中70℃反应,在预氧化的SiC表面能够获得最佳包裹层.
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