以介孔二氧化硅SBA-15为硅源,采用镁热还原法和化学气相沉积(CVD)法合成了具有莲藕状结构的多孔硅/碳复合材料.利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、透射电子显微镜(TEM)和氮气吸脱附法研究了原料配比,混压方式以及反应温度对多孔硅物相组成和结构形貌的影响.多孔硅的最佳合成条件为:镁粉过量20wt％,原料经球磨混合均匀后直接在750℃下高温反应4h.对多孔硅及多孔硅/碳材料进行了电化学性能测试,在0.5 A/g电流密度下循环70次后仍保持1633.1 mAh/g的可逆容量,并且在8 A/g下容量达到580.1 mAh/g,表现出优异的循环稳定性以及倍率性能.
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