利用硅氢加成反应,以4-乙烯基苯并环丁烯(4-VBCB)和1,1,3,3-四甲基-1,3-二氢二硅氧烷(TMHS)为原料,一步法合成了二乙基硅氧烷双苯并环丁烯(DES-bis-BCB),并对以其为单体在热引发条件下生成的预聚体进行了结构表征.利用原子力显微镜和热重分析对预聚体的成膜性能和热性能进行了分析.结果显示,薄膜的均方根(RMS)糙度为0.53 nm,初始分解温度为390℃,表明二乙基硅氧烷双苯并环丁烯聚合物具有良好的成膜性能和优异的热稳定性能.
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