采用高压剪切分散(HPSH)的方法先将纳米SiO2分散在合成聚氨酯原料中,再应用原位聚合的方法制备了纳米SiO2/聚氨酯复合树脂.用热重分析、动态机械热分析(DMTA)和扫描电子显微镜等测试技术研究了纳米SiO2的用量及其分散方法对聚氨酯树脂的热稳定和力学性能的影响.结果表明,二苯甲基二异氰酸酯(MDI)中的-NCO和纳米SiO2表面的-OH发生了化学反应,SiO2表面的包覆率约为7％；通过高压剪切分散的方法能够使纳米SiO2在聚氨酯基体中均匀的分散开来,粒径为30～40 nm,而超声处理的纳米SiO2会聚集约为200 nm聚集体.当SiO2的添加质量分数为3％时复合树脂(HPSH处理SiO2)的拉伸强度和断裂伸长率均达到最大值,分别为84.3 MPa和438.7％.此外,与纯树脂相比,复合树脂(4％纳米SiO2)的Tg、Td和T-50％分别增加了17.2、9和21℃.
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