采用射频磁控溅射法在n-Si(100)衬底上沉积Si1-xGex薄膜,俄歇电子谱(AES)测定Si1-xGex薄膜的Ge含量约为17%.对薄膜进行高温磷扩散掺杂,制得n-poly-Si0.83Ge0.17.在n-poly-Si0.83Ge0.17薄膜上溅射一层Co膜,制成Co/n-poly-Si0.83 Ge0.17/n-Si肖特基结样品.在300～600℃范围内,对样品做快热退火.对不同退火温度下的样品做I-V-T测试.研究发现,测试温度升高,不同退火温度样品的肖特基势垒高度(SBH)的差别变小,500℃退火的样品,表观SBH最小.总体上,SBH随测试温度的升高而变大,理想因子的变化趋势则与之相反.基于SBH的不均匀分布建模,对实验结果给出了较为合理的解释.
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