利用喷射成形技术制备了CuCr25合金触头材料, 研究了雾化压力对显微组织、致密度和收得率的影响, 对制得的沉积坯件进行了热锻压和热等静压致密化处理, 并测试了触头材料的密度、硬度和电导率.研究结果表明:最合适的雾化压力为0.6 MPa, 沉积坯件经过950 ℃锻压后再在1070 ℃, 200 MPa下热等静压8 h, 可以得到全致密的触头材料, 铬颗粒平均直径小于10 μm, 硬度达100 HB, 电导率25～ 29 Ms·m-1, 说明致密化处理后的喷射成形CuCr25合金是一种优良的触头材料.
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