Sn-Ag-Cu系无铅焊料由于具有良好的焊接性能和使用性能, 已逐渐成为一种通用电子无铅焊料;综述了Sn-Ag-Cu系焊料从无到有、从二元发展至三元乃至多元的发展历程, 及其研究现状和当前应用较多的几个典型成分的各自应用水平, 对当前Sn-Ag-Cu系焊料的熔化温度、润湿性、组织结构和力学性能研究方面以及存在的超电势问题、抗氧化和抗腐蚀性不足、使用的可靠性等主要问题作了总结, 并根据国情对其在国内外的发展前景作了预测和展望, 提出在发展无铅焊料过程中需要着重注意研究的几个方面, 并指出今后较长一段时间内不会出现某一种无铅焊料能像Sn-Pb系那样独断电子封装行业的状态.
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