传统的SnPb钎料由于Pb的毒性即将被禁止在微电子连接上使用, 加上现在集成电路小型化、微型化以及高密度化的趋势;对所要开发的无铅钎料性能要求愈来愈高.以 Sn-3.0Ag-0.5Cu钎料为母合金, 添加了不同含量的合金元素Cr以及微量的合金元素Al或P, 得到了一种新的Sn-3.0Ag-0.5Cu-Cr-P, 测得熔点在217 ℃左右, 抗拉强度达46 Mpa, 电导率在8.2(106 S·m-1)以上, 并具有很好的抗氧化性能.
参考文献
| [1] | Mulugeta Abtewa;Guna Selvaduray .Lead-free solders in microelectronics[J].Materials Science and Engineering,2000,27:95. |
| [2] | Kikuchi S;Nishimura M;Suetsugu K et al.Strength of bonding interface in lead-free Sn alloy solders[J].Materials Science and Engineering,2001,A319-321:475. |
| [3] | 马鑫,董本霞.无铅钎料发展现状[J].电子工艺技术,2002(02):47-52. |
| [4] | Zhao Jing;Huang Le;Ma Jusheng.Effects of the addition of In, Bi to Sn-Ag-Cu lead-free solders[A].,2001 |
| [5] | 任晓雪,李明,毛大立.合金元素对Sn-Zn基无铅钎料高温抗氧化性的影响[J].电子元件与材料,2004(11):40-44. |
| [6] | Zeng K;Tu K N .Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J].Materials Science and Engineering,2002,38 R:55. |
| [7] | Masazumi Amagai .Mechanical reliability in electronic packaging[J].Microelectronics Reliability,2002,42:607. |
| [8] | Young T .An essay on the cohesion of fluids[J].Philosophical Transactions of the Royal Society of London,1995,1805:65. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%