采用真空冶炼法制备了低熔点的Ga-Ag-Sn液态合金,分析了Ga含量与液态合金熔点的关系.利用X射线衍射仪、电子扫描显微镜和能谱等多手段对Ga95.0Ag0.15Sn合金与Cu基体的结合界面进行了分析.结果表明,Ga95.0Ag0.15Sn液态合金能与无氧铜基体发生互扩散,并形成致密且与基体结合良好的Ga-Cu界面层而能起到真空修复作用,界面层的相组成为Cu9Ga4相,Cu41Sn11相和α-(Cu,Sn)相.
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