采用熔体快淬法制备了CuCr25(%,质量分数)合金带,将合金中的Cr粒子尺寸细化到了200 nm以下,并通过控制时效在Cu基体中得到了尺寸小于30 nm的Cr共格沉淀.用高真空电弧观测平台对所得试样进行的电击穿测试表明,在小击穿电流(峰值为10 A)条件下,熔体快淬CuCr25合金的平均截流值为1.59 A.不仅比粉末冶金粗晶CuCr25触头材料降低了约50%,而且明显低于Cr粒子尺寸约为50 nm的粉末冶金纳晶触头材料.分析了溶体快淬CuCr25合金的微观组织对其截流值和真空电弧稳定性的影响,并指出熔体快淬法是提高触头材料综合性能的一种有效手段.
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