利用喷射成形技术制备了70Si30Al合金新型电子封装材料,研究了材料沉积态、热压态的显微组织演变规律,测试了材料的各项性能.结果表明:沉积态材料显微组织细小均匀,一次Si相尺寸大约在10~40μm左右,且均匀弥散分布.经过热压后,材料的热膨胀系数为7×10-6~9×10-6 K-1,热导率可以达到120W·m-1·K-1.
参考文献
[1] | White D;Keck S;Smith I .New ground in hybrid packaging[J].Hybrid Circuit Technology,1990,12(01):14. |
[2] | Jacogson D M;Sangha S P S .Future trends in materials for lightweight microwave packaging[J].Microelectron Intl,1998,15(03):17. |
[3] | Hodson Tirnothy .AlN steps up,takes the heat and delivers[J].Electronic Packaging and Production,1997,37(03):34. |
[4] | 王敬欣,张永安.应用于电子封装的新型硅铝合金的研究与开发[J].材料导报,2001(06):18-20,17. |
[5] | 张济山.新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料[J].材料导报,2002(09):1-4. |
[6] | Sangha S.P.S.;Jacobson D.M. .Novel aluminium-silicon alloys for electronics packaging[J].Engineering science and education journal,1997(5):195-201. |
[7] | Jacobson D M;Sangha S P S .Novel low expansion packages for electronics[J].The GEC Journal of Technology,1997,14(01):48. |
[8] | Jacobson D.M.; .Lightweight electronic packaging technology based on spray formed Si-Al[J].Powder Metallurgy,2000(3):200-202. |
[9] | 张智慧,熊柏青,张永安,朱宝宏,刘红伟,石力开.喷射成形Al11.4Zn2.6Mg1.7Cu合金沉积、预热和挤压3种状态的显微组织分析[J].稀有金属,2005(04):534-538. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%