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根据现有氮化镓(GaN)金属有机物化学气相淀积(Metalorganic Chemical Vapor Deposotion)生长动力学理论,结合具体的MOCVD反应腔体的构造,用计算流体力学和动力学蒙特卡罗方法对GaN MOcvD生长过程中的生长速率和表面形貌演变进行了计算机模拟.结果表明,在950~1350 K的温度范围内反应气体充分热分解,是适合GaN外延生长的温度区间;温度低于950 K,反应气体未能充分地分解,导致较低的生长速率;而温度高于1350 K则Ga组分的脱附现象开始变得严重,从而抑制GaN的生长速率.另一方面,较高的v/Ⅲ也会抑制GaN的生长速率.生长过程中表面形貌随时间的演变结果显示,GsN薄膜在高温下(1073~1473 K)为2D层状生长,在1373 K的温度下生长的GaN薄膜表面最为平整.

参考文献

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