采用粉末注射成型/无压浸渗法制备了高体分SiCp/Al复合材料,重点研究了无压浸渗的机制及主要工艺参数对复合材料导热率的影响.结果表明:无压浸渗得以发生主要是由于基体中Mg的挥发,与氮气反应生成氮化镁附着在SiC颗粒上并与表面SiO2膜反应促进润湿.由此得以自发浸渗;随着保温时间的增加,材料的致密度增加,复合材料的导热率在不断升高;随着保温温度的提高,材料的致密度增加,材料的导热率先升高后降低,这主要是由所制材料的界面热阻所引起的.
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