采用光学显微镜(OM)、差示扫描量热法(DSC)、扫描电镜(SEM)和X射线衍射(XRD)等分析手段,以及通过力学性能和电导率测试验证,研究J,新型Al-4.8Cu-0.5Mg-0.3 Ag-0.15Zr合金挤压板带的固溶工艺,研究结果表明:(520~525)℃×(1.5~2)h是较适合该合金的单级固溶工艺,材料在该固溶制度下进行160℃×24 h时效后能够获得515~526 MPa的室温抗拉强度和14%~15%的伸长率,以及41.7%IACS的电导率.
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