采用从头计算(ab initio)的方法对比研究了Si1-xGex合金半导体材料中W缺陷、CiCs缺陷和CiOi缺陷的性质.在S1-xGex合金中,Ge原子不能与缺陷核心的C原子和O原子直接成键,但可能与W缺陷核心的间隙Si原子相连.在含CiOi缺陷的晶胞中,Ge原子倾向于取代沿[110]伸长方向的Si原子.随着合金中Ge含量的升高,W缺陷的形成能不断增加,结构稳定性逐渐降低.与w缺陷不同的是,CiCs缺陷和CiOi缺陷在不同Ge含量的Si1-xGex合金中形成能变化较小,变化幅度在0.15 eV以内,理论研究结果与前人的实验结果相吻合.
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