采用预制件制备,压力浸渗金属工艺制备Diamond/Cu复合材料,分析了cu基体合金化及金刚石颗粒表面金属化情况下,Cr元素对复合材料界面结构和热性能的影响.结果表明,Diamond/Cu-Cr复合材料中金刚石与Cu-Cr合金界面结合良好,Cr元素在界面处发生富集并与金刚石反应生成Cr_3C_2,其界面结构为金刚石-Cr_3C_2-富Cr的Cu-Cr合金层-Cu-Cr基体,复合材料的热导率达到520W·m~(-1)·K~(-1);Diamond-Cr/Cu复合材料中金刚石表面金属化Cr层在熔渗过程中与Cu互扩散,促进界面结合,形成金刚石-Cr_3C_2层-纯Cr层-Cu-Cr互扩散层-Cu的界面结构.与Diamond/Cu-Cr复合材料相比界面处增加了Cr层,材料的热导率仅为279W·m~(-1)·K~(-1),但均高于Diamond/Cu复合材料的热导率.
Diamond/Cu composites were fabricated by pressure infiltration process. Influences of Cr element on interface structures and thermal properties of the Diamond Cu composites were analyzed. It was found that in Diamond/Cu-Cr composites, Cr accumulated on the interface and reacted with Diamond to form Cr_3 C_2, which promoted the interfacial bonding. The interface structure formed between Diamond and Cu-Cr alloy was Diamond-Cr_3 C_2 with rich Cr Cu-Cr alloy with Cu-Cr alloy sequentially. And the thermal conductivity is 520 W·m~(-1)·K~(-1). In Diamond-Cr/Cu composites, Cr coating on Diamond inter-diffused with Cu during the infiltration process, which accelerated the interfacial bonding. The interface structure, Diamond-chromium carbide-Cr-inter-diffusion layer between Cu and Cr-Cu, was formed. Compared with Diamond/Cu-Cr composites, Cr layer existed in the interface of Diamond-Cr/Cu composites. The thermal conductivity of Diamond-Cr/Cu composites was 279 W·m~(-1)·K~(-1) , higher than that of Diamond/Cu composites.
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