用磁控共溅射法制备含铌1.16%～27.04%(原子分数)的Cu-Nb合金薄膜,运用EDX,XRD,SEM,TEM,显微硬度仪和电阻仪对沉积态和热退火态薄膜的成分、结构和性能进行了研究.结果表明,Nb添加显著影响Cu-Nb合金薄膜微结构,使Cu-Nb薄膜晶粒细化,含铌1.82%～15.75%的Cu-Nb膜呈纳米晶结构,存在Nb在Cu中的fec Cu(Nb)非平衡亚稳过饱和同溶体,固溶度随薄膜Nb浓度增加而上升,最大值为8.33%Nb.随Nb含量增加,薄膜中微晶体尺寸减小,Cu-27.04%Nb膜微结构演变至非晶态.与纯Cu膜对比表明,Nb添加显著提高沉积态Cu-Nb薄膜显微硬度和电阻率,总体上二者随膜Nb含量上升而增高.Nb含量高于4.05%时显微硬度增幅趋缓,非晶Cu-Nb膜硬度低于晶态膜,电阻卒则随铌含量上升而持续增加.经200,400及650℃退火1h后,Cu-Nb膜显微硬度降低、电阻率下降,降幅与退火温度呈正相关.XRD和SEM显示,650℃退火后晶态Cu-Nb膜基体相发生晶粒长大,并出现亚微米级富Cu第二相,非晶Cu-27.04%Nb膜则观察到晶化转变和随后的晶粒生长.Nb添加引起晶粒细化效应以及退火中基体相晶粒度增大是Cu-Nb薄膜微观结构和性能形成及演变的主要原因.
参考文献
| [1] | 韩胜利,宋月清,崔舜.烧结参数对钼-铜合金组织和性能的影响[J].稀有金属,2009(05):666-669. |
| [2] | 詹土生,朱玉斌,徐伟,孙远,杨宁.预加铜粉对85W-Cu板材性能的影响[J].稀有金属,2009(05):675-679. |
| [3] | WangTL;Li J H;Tai K P;UuBX.Formation of amorphous phases in an immiscible Cu-Nb system studied by molecular dy-namics simulation and ion beam mixing[J].Scripta Materialia,2007(57):157. |
| [4] | Jha S C;Delagi R G;Forster J A;Krotz P D .High-strength high-conductivity Cu-Nb microcomposition sheet fabricated via mutiple roll bonding[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1993,24(01):15. |
| [5] | 陈军,毛昌辉.铝铜互连线电迁移失效的研究[J].稀有金属,2009(04):530-533. |
| [6] | Chu J P;Lin C H;Heieh Y Y .Thermal performance of sput-tered insoluble Cu(Nb) films for advanced barrierless metalliza-tion[J].Journal of Electronic Materials,2006,35(01):76. |
| [7] | Demkowicz MJ;Hoagland RG .Structure of Kurdjumov-Sachs interfaces in simulations of a copper-niobium bilayer[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2008(1):45-52. |
| [8] | Mahalingam T;Lin CH;Wang LT;Chu JP .Preparation and characterization of sputtered Cu films containing insoluble Nb[J].Materials Chemistry and Physics,2006(2/3):490-495. |
| [9] | Chu JP.;Lin CH.;Lin TN.;Wang SF.;Liu CJ. .Characterizations of super hard Cu films containing insoluble W prepared by sputter deposition[J].Materials Chemistry and Physics,2001(2):286-289. |
| [10] | Zeng F;Gao Y;Li L;Li D M Pan F.Elastic modulus and hardness of Cu-Ta amorphous films[J].Journal of Alloys and Compounds,2005(389):75. |
| [11] | Zong R L;Wen S P;Zeng F;Gao Y Pan F.Nanoindentation studies of Cu-W alloy films prepared by magnetron sputtering[J].Journal of Alloys and Compounds,2008(464):544. |
| [12] | 王德宝,吴玉程,王文芳,宗跃.机械合金化诱导难互溶系Cu-Cr合金固溶度扩展的研究[J].稀有金属,2008(01):17-22. |
| [13] | Zeng F.;Pan F.;Zhao B. .Metastable phases formation in Cu-Nb films by ion-beam-assisted deposition[J].Nuclear Instruments and Methods in Physics Research, Section B. Beam Interactions with Materials and Atoms,2001(3/4):311-317. |
| [14] | Barmak K;Gungor A;Collett A D;Cabral C Jr Harper J M E.Texture of Cu and dilute binary Cu-alloy films:impact of annea-ling and solute content[J].Materials Science in Semiconductor Processing,2003(06):175. |
| [15] | 郭中正,孙勇,段林昆,郭诗玫,李玉阁.溅射沉积Cu-W合金薄膜的结构及力学性能[J].稀有金属,2010(01):38-43. |
| [16] | 潘金生;仝健民;田民波.材料科学基础[M].北京:清华大学出版社,1998:91. |
| [17] | LinCH;Chu J P;Mahalingam T;Lin T N Wang S F .Sput-tered copper films with insoluble Mo for Cu metallization a thermal annealing study[J].Journal of Electronic Materials,2003,32(11):1235. |
| [18] | Saunders N;Miodonbnik A P.Phase formation in co-deposited metallic alloy thin films[J].Journal of Materials Science,1987(22):629. |
| [19] | Lam N Q;Okamoto PR .A unified approach to solid-state amorphization and melting[J].Materials Research Bulletin,1994,19:41. |
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