欢迎登录材料期刊网

材料期刊网

高级检索

应用新型生产线固溶处理工艺对Cu-2.8Ni-0.7Si-0.1Mg合金进行处理,研究了时效温度、时效时间和时效前不同变形量对Cu-2.8Ni-0.7Si-0.1Mg合金微观组织和性能的影响.结果表明,合金在450℃时效时,第二相呈细小弥散状态分布在基体上,能获得较好的综合性能,在450℃时效4 h时,其导电率和显微硬度分别可达38.13%IACS和212.6HV.经过对选区电子衍射花样的标定,析出相为Ni<,2>Si.合金经冷轧变形后内部出现大量的晶体缺陷,能在时效初期促进第二相的析出,使合金具有更好的综合性能,合金经60%变形后在450℃时效1 h后其导电率和显微硬度分别可达38.78%IACS和232.1 HV.继续升高时效温度或延长时效时间会引起第二相长大而导致显微硬度的升降.通过对生产线固溶和常规实验室固溶处理的合金进行性能比较,生产线固溶态合金的显微硬度时效后低于常规固溶处理合金,这可能是由生产线固溶时的不彻底性所导致.

参考文献

[1] Liu P;Su J H;Dong Q M;Li H J .Optimization of aging treat ment in lead frame copper alloy by intelligent technique[J].Materials Letters,2005,59(26):3337.
[2] Liu Ping,Kang Buxi,Cao Xingguo,Huang Jinliang,Gu Haicheng.Coherent strengthening of aging precipitation in rapidly solidified Cu-Cr alloy[J].中国有色金属学会会刊(英文版),1999(04):723-727.
[3] Huang F X;Ma J S;Ning H L;Cao Y W Geng Z T .Precipitation in Cu-Ni-Si-Zn alloy for lead frame[J].Materials Letters,2003,57(13-14):2135.
[4] V.C. Srivastava;A. Schneider;V. Uhlenwinkel .Age-hardening characteristics of Cu-2.4Ni-0.6Si alloy produced by the spray forming process[J].Journal of Materials Processing Technology,2004(2):174-180.
[5] LEI Qian,LI Zhou,PAN Zhi-yong,WANG Ming-pu,XIAO Zhu,CHEN Chang.Dynamics of phase transformation of Cu-Ni-Si alloy with super-high strength and high conductivity during aging[J].中国有色金属学报(英文版),2010(06):1006-1011.
[6] 蔡薇,彭丽军,任欣,王玉霞,陈绍广,肖翔鹏.Cu-10Ni-4.5Sn弹性合金的固溶时效与组织性能研究[J].稀有金属,2010(04):526-530.
[7] Ryoichi Monzen;Chihiro Watanabe.Microstructure and mechanical properties of Cu–Ni–Si alloys[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008:117-119.
[8] Long Y Q;Liu P;Liu Y;Zhang W M Pan J S .Simulation of recrystallization grain growth during re-aging process in the Cu-Ni-Si alloy based on phase field model[J].Materials Letters,2008,62(17-18):3039.
[9] Sun Z;Laitem C;Vincent A .Dynamic embrittlement at intermediate temperature in a Cu-Ni-Si alloy[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2008,477(1-2):145.
[10] Hui Xie;Lei Jia;Zhenlin Lu .Microstructure and solidification behavior of Cu-Ni-Si alloys[J].Materials Characterization,2009(2):114-118.
[11] Zhao D M;Dong Q M;Liu P;Kang B X Huang J L Jin Z H .Aging behavior of Cu-Ni-Si alloy[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2003,361(1-2):93.
[12] 刘平;苏娟华.新型铜铬系合金及其制备技术[M].北京:科学出版社,2007
[13] Fujiwara H;Sato T;Kamio A .Effect of alloy composition on precipitation behavior in Cu-Ni-Si alloys[J].Journal of the Japan Institute of Metals,1998,62(04):301.
[14] Lockyer S A;Noble F W .Precipitate structure in a Cu-Ni-Si alloy[J].Journal of Materials Science,1994,29:218.
[15] Suzuki S;Shibutani N;Mimura K;Isshiki M Waseda Y .Improvement in strength and electrical conductivity of Cu-Ni-Si alloys by aging and cold rolling[J].Journal of Alloys and Compounds,2006,417:116.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%