真空蒸镀法结合溶胶凝胶法成功地制备Cu-TiO23层复合结构薄膜.运用XRD,SEM,UV-vis等手段进行结构表征和光吸收性能测试.通过模拟可见光下制备样品对亚甲基蓝溶液降解率的变化,评定其光催化活性.结果表明:该法制备的复合结构薄膜,在未热处理时真空蒸镀的金属层为单质Cu.在723 K热处理后,沉积的Cu被氧化主要以Cu2O的形式存在,而TiO2为单一的锐钛矿晶型.823K保温2.0 h热处理后Cu2O进一步被氧化为CuO,同时出现了少量金红石型TiO2.由于Cu2O与CuO均为窄带隙的半导体,在可见光照射下会发生电子由价带向导带的跃迁,因此复合薄膜表现出明显的可见光吸收性能.降解实验的结果则表明:不同温度热处理后的复合薄膜均表现出较高的光催化活性,特别是723K热处理后的复合薄膜样品可见光催化活性最好,在可见光照射5.0 h后对亚甲基蓝溶液降解率接近100%.分析其原因认为,P型的Cu2O和CuO与n型TiO2半导体接触后,在其界面形成了纳米异质结的结合,其p-n结的内建电场抑制了光生载流予的再复合,提高了量子产率,因此使复合薄膜表现出较高的光催化性能.
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