应用铸造快冷及可控结晶技术制备3种玻璃陶瓷纳米复合介电材料——PbNb2O6 +NaNbO3 +SiO2 (PNS),BaNb2O6+ NaNbO3+ SiO2 (BNS)和SrNb2O6+ NaNbO3+ SiO2( SNS).研究了这3种复合材料的结晶性能,微观形貌和介电性能.X射线衍射(XRD)的分析结果显示:PNS及SNS的玻璃在750℃可控结晶时,均形成中间相A2Nb2O-7(A=Pb,Sr),且该中间相在850℃时消失,此时形成MNb2O6+NaNbO3(M=Pb,Sr)的高介电常数相,而BNS则未经过中间相,在750℃直接析出MNb2O6+NaNbO3(M=Ba)的高介电常数相.在所有的样品中,随着退火温度的升高,晶粒均有逐渐长大聚集的趋势.同时,SNS玻璃陶瓷在750℃及850℃结晶退火处理时,均析出枝状晶粒,异于PNS和BNS的球状晶粒.由可控结晶技术制备的玻璃陶瓷介电性能受热处理过程中所形成的介电相组成及其体积分数和晶粒尺寸的影响很大.分析测试了这3种体系玻璃陶瓷的介电常数与结晶化处理温度之间的关系及介电常数的电场稳定性.在900℃结晶退火时,PNS玻璃陶瓷具有最高的介电常数( ～501,1 kHz),而BNS的介电常数在0～15 kV ·mm-1的测试范围内具有最好的电场稳定性(＜15％).
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