采用磁控溅射技术在p-Si(100)衬底上生长了Gd2O3掺杂HfO2( GDH)高κ薄膜,制备了GDH/Si和GDH/Al2O3/Si两种堆栈层.结果表明Al2O3界面钝化使漏电流密度降低了两个数量级,并改善了回滞窗口和平带电压的偏移.高温N2退火对堆栈层电学性能影响明显:随着温度的增加,界面性能逐步改善,退火温度为900℃时,回滞窗口小于20 mV,积累区趋势平缓并且单位面积电容值增大,薄膜介电常数为20.
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