电子封装用金刚石/铜复合材料中金刚石颗粒与基体纯铜的界面不润湿,界面结合状态差.通过引入碳化物形成元素Cr,Ti,B等来改善两者界面结合状态,结果表明在铜基体中加入碳化物形成元素制备的复合材料比涂覆碳化物形成元素后金刚石颗粒制备的复合材料界面结合紧密,热导率高.而另一种改善界面结合状态的方法是在此基础上增大金刚石与基体之间接触面积.对比品级差异较大的破碎料金刚石与六八面体金刚石制备的复合材料的热导率性能发现,破碎料金刚石表面积的增大有利于更充分的发挥金刚石的导热性能,且原材料成本大大降低,此类材料也将有一定的应用空间；而针对细颗粒金刚石通过表面腐蚀方法来增大表面积,预计制备的复合材料热导率也会有不同程度地提高.
参考文献
| [1] | ZHANG Ximin,GUO Hong,YIN Fazhang,FAN Yeming,ZHANG Yongzhong.Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications[J].稀有金属（英文版）,2011(01):94-98. |
| [2] | 张习敏,郭宏,尹法章,张永忠,范叶明.Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响[J].稀有金属,2010(02):221-226. |
| [3] | 范叶明,郭宏,尹法章,张习敏,褚克,韩媛媛,徐骏.氢气热处理对铜/金刚石复合材料组织性能的影响[J].材料热处理学报,2011(11):7-11. |
| [4] | Ke Chu;Zhaofang Liu;Chengchang Jia .Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2010(1/2):453-458. |
| [5] | Dong, Y.-H.;He, X.-B.;Rafi-Ud-Din;Xu, L.;Qu, X.-H. .Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration[J].Journal of Materials Science,2011(11):3862-3867. |
| [6] | H. Chen;K. Chu .Effective thermal conductivity of Cu/diamond composites containing connected particles[J].Materials Science and Technology: MST: A publication of the Institute of Metals,2011(3):713-716. |
| [7] | 尹法章,郭宏,张习敏,贾成厂,范叶明,张永忠.添加微量Ti元素对Diamond/Cu复合材料组织及性能的影响[J].复合材料学报,2010(03):138-143. |
| [8] | L. Weber;R. Tavangar .On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites[J].Scripta materialia,2007(11):988-991. |
| [9] | Schubert T;Trindade B;Weissgarber T;Kieback B .Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2008(1/2):39-44. |
| [10] | Y. H. Wang;J. B. Zang;M. Z. Wang;Y. Guan;Y. Z. Zheng .Properties and applications of Ti-coated diamond grits[J].Journal of Materials Processing Technology,2002(1/3):369-372. |
| [11] | 张毓隽,童震松,沈卓身.SPS方法制备铜/金刚石复合材料[J].北京科技大学学报,2009(08):1019-1023. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%