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运用传统固相法合成了Re掺杂的Mo3-xRexSb7(x=0,0.05,0.10)系列化合物,并通过热压烧结得到了致密样品.采用X射线粉末衍射(XRD)和X射线能量色散谱(EDS)表征了样品的相成分,同时经过第一性原理计算分析了Re掺杂对Mo3Sb7能带结构的影响,进而研究了Re掺杂对Mo3Sb7热电性能影响的规律.结果表明:当掺杂量x≤0.1时,Re均匀地掺杂于晶格中形成固溶体且所有样品均无第二相杂质生成,同时晶胞参数随着Re掺杂量的增长而减小.Mo3Sb7作为一种P型三维导电材料,当每化学单位的Mo3Sb7额外获得两个化学单位的价电子将由金属转变为半导体.在Re掺杂后Mo3 Sb7费米面上移,这是因为Re比Mo多一个价电子,但由于固溶度的限制,Re掺杂并不能使其转化为半导体,且Re掺杂对于费米面处能带形状以及禁带宽度的影响也非常有限.由于Re较多的价电子,因此Re的引入降低了化合物Mo3Sb7的电导率,并提高了其热电势值,而电导率的降低也必然会减小载流子贡献的热导率,同时Re掺杂增加了晶格无序也降低了其晶格热导率,因此Mo3Sb7总的热导率得到了降低,最后其热电性能得到了提高.其中,经过Re掺杂后的化合物Mo2.90Re0.10Sb7在860 K下ZT值达到0.127,比化合物Mo3Sb7提高了23.3%.

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