本文采用XRD和SEM技术分析了具有不同临界电流密度(Jc)的Bi系多芯超导带材.结果表明,样品中Bi-2223晶粒高度取向排列,其取向因子F值在0.947~0.977范围内.SEM分析结果发现,高Jc样品中在平行于带材平面的片状的Bi-2223晶粒的晶界处残留的杂质主要为CuO晶粒,它与Bi-2223晶体结合紧密.在低Jc 的样品中,Bi-2223晶片边界存在的杂质颗粒尺寸较大,其成分为(Sr,Ca)CuO和CuO的混合体.样品的横断面和纵断面的SEM观察发现,在高性能的样品中,芯丝烧结体的致密度较高.枝条状Bi-2223晶体穿过银层,在芯丝之间形成了很强的连接体.本文讨论了临界电流密度与微观组织的关系.
参考文献
[1] | S Kobayashi;T Kaneko;N Ayai K Hayashi;H Takei,R Hata .[J].Physica C,2001,357-360:1115-1118. |
[2] | A Polyanskii;D M Feldmann;S Patnaik;J Jiang,X Cai,D Larbalestier,K Demoranville,D Yu,R Parrella .[J].IEEE Transactions on Applied Superconductivity,2001,11 |
[3] | O Eibl .[J].Superconductor Science and Technology,1995,8:833-861. |
[4] | Reynald Passerini;Marc Dhalle;Enrico Giannini .SEM investigation of outgrowths formation mechanism in Ag-sheathed Bi,Pb(2223) tapes[J].Superconductor Science & Technology,2002(8):1203-1212. |
[5] | 郑会玲;张平祥 等.[J].低温物理学报,1999,21(zk):582-585. |
[6] | Fumitake Nakao;Kozo Osamura .[J].Superconductor Science and Technology,2005,18:513-520. |
[7] | Perkins G.K.;Bugoslavsky Yu.V.;Qi X.;MacManus-Driscoll J.L.;Caplin A.D. .High field scanning Hall probe imaging of high temperaturesuperconductors[J].IEEE Transactions on Applied Superconductivity: A Publication of the IEEE Superconductivity Committee,2001(1):3186-3189. |
[8] | Bugoslavsky Y.;Perkins G.;Buscemi P.;Caplin A.D.;Leghissa M.;Oomen M.P. .Conductor architecture, filamentary interconnections and currentdistribution in BiSCCO-2223-based tape conductors[J].IEEE Transactions on Applied Superconductivity: A Publication of the IEEE Superconductivity Committee,2001(1):2788-2791. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%