用冷压-烧结-热挤压工艺制备了SiCp/Cu复合材料,得到组织均匀、致密、导电导热的复合材料.干磨损试验结果表明,随着SiC含量的提高,复合材料具有更高的耐磨性;SiC颗粒增强物的加入减小了材料的粘着磨损,使复合材料在高载荷条件下具有更为优越的耐磨性.SiC体积分数不超过15%的铜基复合材料具有比铬锆铜合金更高的导电、导热性能和耐磨性.
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