对Sn3.0Ag2.8Cu/Cu焊点等温时效后其界面组织的变化进行了SEM、OM以及EDX分析研究,并与Sn37Pb/Cu焊点进行了比较.结果表明:在焊料与铜基板界面上存在Cu6Sn5和Cu3Sn两种金属间化合物,时效过程中Sn3.0Ag2.8Cu焊料与铜的生长速度较慢,金属间化合物的生长属于扩散控制.
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