氮化铜薄膜的光学性能及其突出的低温热分解特性,使得它在信息存储方面有广阔的应用前景.本文概述了国际上制备多晶态氮化铜薄膜的研究进展及其物理性能,并对其应用前景进行展望.
参考文献
| [1] | Hahn U;Weber W .Electronic Structure and Chemical-bonding Mechanism of Cu3 N, Cu3 NdP and Related Cu(I) Compounds[J].Physical Review B,1995,53(19):12684-12693. |
| [2] | Nosaka T;Yoshitake M I et al.Copper Nitride Thin Films Prepared by Reactive Radio-frequency Magnetron Sputtering[J].Thin Solid Films,1999,348:813. |
| [3] | Terada S;Tanaka H;Kubota K .Heteroepitaxial Growth of Cu3N Thin Films[J].Journal of Crystal Growth,1998,94(02):567-568. |
| [4] | Blucher J;Bang K;Glessen B C .Preparation of the Metastable Interstitial Copper Nitride, Cu4 N by DC Plasma Ion Nitriding[J].Materials Science and Engineering,1989,A1171:1-3. |
| [5] | Maruyama T;Morishita T .Copper Nitride and Tin Nitride Thin Films for Write-once Optical Recording Media[J].Applied Physics Letters,1996,69(07):890-891. |
| [6] | Asano M;Umeda K;Tasaki A .Cu3 N Thin Film for a New Light Recording Media[J].Japanese Journal of Applied Physics,1990,29(10):1985-1986. |
| [7] | 吴志国,张伟伟,白利峰,王君,阎鹏勋.纳米Cu3 N薄膜的制备与性能[J].物理学报,2005(04):1687-1692. |
| [8] | Soto G;Dy'az J A;W de la Cruz .Copper Nitride Films Produced by Reactive Pulsed Laser Deposition[J].Materials Letters,2003,57:4130-4133. |
| [9] | Fendrych F;Soukup L;Jastraby'ka L et al.Cu3 N Films Prepared by the Low-pressure RF Supersonic Plasma Jet Reactor Structure and Optical Properties[J].Diamond and Related Materials,1999,8:1715-1719. |
| [10] | Kwang Joo Kim;Jong Hyud Kim;Ji Hoon Kang .Structural and optical characterization of Cu_3N films prepared by reactive RF magnetron sputtering[J].Journal of Crystal Growth,2001(4):767-772. |
| [11] | Maruyama T.;Morishita T. .COPPER NITRIDE THIN FILMS PREPARED BY RADIO-FREQUENCY REACTIVE SPUTTERING[J].Journal of Applied Physics,1995(6):4104-4107. |
| [12] | Dao-Yuan Wang;Norio Nakamine;Yasunori Hayashi .Properties of various sputter-deposited Cu-N thin films[J].Journal of Vacuum Science & Technology, A. Vacuum, Surfaces, and Films,1998(4):2084-2092. |
| [13] | Maya L .Deposition of Crystalline Binary Films of Tin Copper and Nickel by Reactive Sputtering[J].Journal of Vacuum Science and Technology A-Vacuum Surfaces and Films,1993,11(03):604-608. |
| [14] | Pierson J F .Structure and Properties of Copper Nitride Films Formed by Reactive Magnetron Sputtering[J].Vacuum,2002,66:59-64. |
| [15] | Klug P;Alexander L E.X-ray Diffraction Procedures for Polycrystalline and Amorphous Materials[M].Wiley,New York,1974:687-708. |
| [16] | Nosaka T.;Okamoto A.;Ogawa S.;Nakayama Y.;Yoshitake M. .Thermal decomposition of copper nitride thin films and dots formation by electron beam writing[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(0):358-361. |
| [17] | Z. Q. Liu;W. J. Wang;T. M. Wang;S. Chao;S. K. Zheng .Thermal stability of copper nitride films prepared by rf magnetron sputtering[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1998(1/2):55-59. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%