本文报道用在Si台面及热氧化SiO2衬底上3C-SiC薄膜的LPCVD生长,反应生长使用的气体为SiH4和C2H4,载气为H2,采用光学显微镜、X射线衍射(XRD)、X射线光电子能谱(XPS)、扫描电镜(SEM)、以及室温Hall测试对所生长的3C-SiC材料进行了测试与分析,结果表明在3C-SiC和SiO2之间没有明显的坑洞形成.
This paper presents the development of LPCVD growth of 3C-SiC thin films grown on Si mesas and thermally oxidized SiO2 masks over Si with an area of 150 × 100μm2 and SiO2/Si substrates. The growth has been performed via chemical vapor deposition using SiH4 and C2H4 precursor gases with carrier gas of H2. 3C-SiC films on these substrates were characterized by optical microscopy, X-ray diffraction ( XRD ), X-ray photoelectron spectroscopy ( XPS), scanning electron microscopy (SEM) and room temperature Hall effect measurements. It is shown that there were no voids at the interface between 3C-SiC and SiO2.
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