主要研究了在不同的电镀工艺条件下,电沉积铁镀层的微观组织特点及织构演化规律.对镀层中的应力状态进行了分析,将应力对织构形成的影响因素加以充分考虑,并在此基础上,恰当地解释了纯铁镀层中的(211)丝织构的形成机理.同时,研究了表面能变化对沉积织构的影响.
参考文献
[1] | 李明;江红;崔永植 .低温铁合金电镀修复强化技术[J].材料保护,1990,23(07):18. |
[2] | Bredael E;blanpain B;Celis J.On the Amorphous and Crystalline State of Electro-Deposited Nickel-Phosphrous Coatings[J].Journal of the Electrochemical Society,1994(141):294. |
[3] | Bassett G A;Menter J W;Pashley D W.Moire Patteerns on Electron Micrographs and Their Application to the Study of Dislocations in Metals[J].Proceedings of the Royal Society of London,1958(246):345. |
[4] | Knorr D B.Formation Mechanism of Electroplated Film and Its Texture[J].Materials Science Forum,1994(157-162):1327. |
[5] | Baskes M I.Modified Embedded-Atom Potentials for Cubic Materials and Impurities[J].Physical Review B,1994(46):2727. |
[6] | Liu Y D;Wang Y D;Xu J Z et al.Initial and Annealing Textures of Iron Electro-Deposits[J].ICOTOM,1996,11(02):1165. |
[7] | Wang YD.;Xu JZ.;Liang ZD.;Liu YD. .A NEW ALGORITHM OF QUANTITATIVE TEXTURE ANALYSIS ADAPTED TO THIN FILMS[J].Journal of Applied Physics,1996(9):7376-7378. |
[8] | 唐兆麒;关鲁雄;刘承科.薄膜晶粒大小与薄膜厚度的关系探讨[J].金属材料研究,1997(23):5-7. |
[9] | Heurle F M.Metallurgical Topics in Silion Device Interconnections:Thin Film Stresses[J].International Materials Reviews,1989(34):53. |
[10] | Chaudhari P.Grain Growth and Stress Relief in Thin Films[J].Journal of Vacuum Science and Technology,1972(09):520. |
[11] | Houtte P V.Simulation of the Rolling and Shear Texture of Brass by the Taylor Theory Adapted for Mechanical Twining[J].Acta Materialia,1978(26):591. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%