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研究了在新型尿素氯化物硫酸盐混合物三价铬溶液中电镀铬的工艺条件对镀层的影响,详细考察了电流密度、pH值、络合剂浓度、恒电流/恒电位方式对电流效率和镀层外观质量的影响.结果表明:pH值在1.9~2.3之间、电流密度在7~11 A/dm2范围内、络合剂浓度为2 mol/L时获得的镀层能达到较大厚度和较高的电流效率,镀层光亮致密.在此工艺条件下,可获得30~40 μm的镀层.提出了三价铬电化学聚合的新假设.

参考文献

[1] [P].US Pat,4 543 167,1985.
[2] [P].US Pat,4 472 250,1984.
[3] 屠振密.三价铬电镀机理的研究--铬层不能增厚的原因[J].材料保护,1985(03):14.
[4] Tu Z M;Yang Z L;Zhang J S .Pulse Plating With a Trivalent Chromium Plating Bath[J].Plating and Surface Finishing,1990,77(10):55.
[5] An Kong H;Kong-Nam Ch;Mei-Fatt Ch .Chromium Deposition From Trivalent Chromium-Thiocyanate Bath[J].Metal Finishing,1994,81(05):11.
[6] Howarth J N;Pletcher D .The Electrodeposition of Chromium From Chromium(Ⅲ) Solution-A Study Using Microelectrodes[J].Journal of Applied Electrochemistry,1988,18:644.
[7] Stunzi H;Spiccia L;Rotzinger F P et al.Early Stages of the Hydrolysis of Chromium(Ⅲ) in Aqueous Solution[J].Inorganic Chemistry,1989,28:66.
[8] Watson A;Anderson A M H;El-Sharif M R et al.The Role of Chromium Ⅱ Catalysed Elation Reactions in the Sustained Deposition of Chromium and Its Alloys From Enviromentally Acceptable Chromium Ⅲ Electrolytes[J].Transactions of The Institute of Metal Finishing,1990,68:26.
[9] Waston A;Chisholm C U;El-Sharif M R .The Role of Chromium Ⅱ and Ⅵ in the Electrodeposition of Chromium Nickel Alloys From Trivalent Chromium-Amide Electrolytes[J].Transactions of The Institute of Metal Finishing,1986,64:149.
[10] 蒋汉瀛,王先友,郭炳昆.次亚磷酸盐溶液电镀三价铬工艺的电化学[J].中国有色金属学报,1996(02):28-31.
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