用动电位扫描法研究 Ni-Ce-P合金电沉积行为，结果表明：配体和 H3PO3 可使金属离子的析出电位正移，加上Ni2+的诱导共沉积，使得 Ni-Ce-P合金从水溶液中电沉积出来，XPS谱图和能量弥散仪测试结果表明，镀层成分分别为：81．9(wt)％ Ni，9．77(wt)％Ce，6．32(wt)％P。
The mechanism of Ni-Ce-P alloy electrodeposition in aqueous solutions was studied with linear sweep voltammetry (LSV). It showed that the electrodeposition potentials of metallic ions shifted toward positive drection because of the effects of complexing agents and H3PO3 as well as the induction effect of Ni2 +. The components of the deposit were 81.9% Ni, 9. 77% Ce and 6. 32% P.
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