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采用脉冲电镀法在紫铜和钢制试样上制备镀镍层。用SEM和X衍射仪观察和研究了脉冲电镀镍层的表面形貌微观结构,测试了镀层硬度,测量了试样在7 mol/L HNO3溶液中的耐蚀性。用滤纸法和挠度弯曲法测试了镀层的孔隙率和内应力。研究结果表明,脉冲电镀镍层与直流镀镍层相比,结晶细密,孔隙率低,内应力和硬度提高,这主要是存在[200]晶面择优取向的结果。

CaiIiao BaoHhu 2001, 34(1),10~11(Ch).The nickel coating has been prepared on copper and steel sample bypulse plating, and surface morphology and microstructure were studiedby SEM and XRD. Compared with direct current plated copper coating,the pulse plated coating was more compact in structure with [200]preferred orientation, and their properties were obviously superior to thatof DC plated coating. The relationship between deposit structure andproperties was discussed.

参考文献

[1] Norman M Osem.An Overview of Pulse Plating[J].Plating and Surface Finishing,1986(10):20.
[2] Vincent B;Bercot P;Creusat G F.Gold Deposits Obtained by Pulse Plating[J].Plating and Surface Finishing,1990(12)
[3] Wang J Y;Balamurugan D;Chin D T .An Experimental Study of Mass Transfer in Pulse Reversal PLating[J].Journal of Applied Electrochemistry,1992,22:240.
[4] Tang P T;Watanabe T;Andersen J E T et al.Improved Corrosion Resistance of Pulse Plated Nickel Through Crystallization Control[J].Journal of Applied Electrochemistry,1995,25(01)
[5] 李颖;李川生 等.[J].材料保护,1997,30
[6] 《电镀工艺手册》编写组.电镀工艺手册[M].北京:国防工业出版社,1984
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