测定了以羟基羧酸盐作配体的电镀枪黑色Ni-Sn合金的碱性溶液各组分的自然消耗和生产性消耗，确定了镀液中能够抑制Sn2+氧化的稳定剂，制定了清除镀液中Zn2+、Fe2+和Cu2+等金属杂质的电解方法。结果表明，亚锡盐的自然消耗是引起镀液自然静置时不稳定的唯一因素；镀液生产性消耗，亚锡盐下降率最大，镍盐最小；以小电流电解可除去Zn2+、Fe2+和Cu2+杂质。
Cailiao Baohu 2001,34(3),25～ 26(Ch).The spontaneous and productive consuming of the components in alkaline bath solution for gun-color Ni-Sn plating when using hydroxy carboxy late as complex agent was studied.It was shown that the spontaneous consume of Sn2＋ could be the unique factor leading the bath solution unstable,and the Sn2＋ was reduced much more than Ni2＋ in productive consuming.The Zn2＋ ,Fe2＋ and Cu2＋ impurities could be moved out from the solution by electrolylic method.
参考文献
| [1] | 木夏本英彦;小见崇;朱立群.装饰·防护·功能性合金电镀[M].北京:航空工业出版社,1989 |
| [2] | Antler M.Contact Resistance of Tin-nickel Alloy Electrodeposits[J].Journal of the Electrochemical Society,1978:125. |
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