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从原有的化学镀铜的工业配方出发,对其用量进行改良,特别是镀液的pH值调试,配体的使用和还原剂的用量,在硅片上沉积出一层光亮而且致密的铜薄膜.结果表明,在二甲基亚砜中硅铜基体上的电沉积铋薄膜均匀、致密、粘附力强,XRD测试表明铋以晶体析出.

参考文献

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