综述了非金属表面化学镀前处理工艺的现状和发展,对陶瓷化学镀的粗化和活化工艺的新进展进行了评述,侧重讨论了离子型、胶体钯型、浆料型、分子自组装吸附钯型、贱金属型活化工艺特点和进展,并展望了今后发展方向.
参考文献
| [1] | Abner Brenner;Grace E. Riddell .Nickel plating on steel by chemical reduction[J].Plating & Surface Finishing,1998(8):54-56. |
| [2] | Henry J R.The Importance of Substrate Prepartion for Porper Electroless Nickel and Electroless Nickel Composite Deposition[A].Indiana:[s.n.],1999 |
| [3] | 周琦.陶瓷仿古铜色电镀工艺[J].电镀与精饰,2000(01):25-27. |
| [4] | DeLuca;Michael A .Surface Preparation of Ceramic Substrates for Metalizaion[P].US 4647477,1987. |
| [5] | 沈伟,彭德全,沈晓丹.Al<,2>O<,3>陶瓷表面金属化[C].第六届全国化学镀会议论文集,2002:14-20. |
| [6] | Yoshiki H.;Fujishima A.;Hashimoto K. .REACTION MECHANISM OF ELECTROLESS METAL DEPOSITION USING ZNO THIN FILM (I) - PROCESS OF CATALYST FORMATION[J].Journal of the Electrochemical Society,1995(2):428-432. |
| [7] | Law H H;Mattoe C A;Thomson J.Robust-Design of a Metallization Process for Ceramic Substrates[A].:379-382. |
| [8] | Severin J W;Hokke R;Wel H et al.A Study on Changes in Surface Chemistry During the Initial Stages of Electroless Ni(P) Deposition on Alumina[J].Journal of the Electrochemical Society,1993,140(03):682-687. |
| [9] | Yoshiki H;Alexandruk V;Hashimoto K et al.Electroless Copper Plating Using ZnO Thin Film Coated on a Glass Substrate[J].Journal of the Electrochemical Society,1994,141:56. |
| [10] | 袁高清.塑料电镀前处理无铬“三合一”新工艺[J].新技术新工艺,1997(03):40-41. |
| [11] | Kanoh;Osamu;Yoshida et al.Activating Catalytic Solution for Electroless Plating and Method for Electroless Plating[P].US:5989787,1999. |
| [12] | 陈达宏.印制电路孔金属化[J].电子工艺技术,2001(03):102-105. |
| [13] | 董根岭.TY-1型无锡（Ⅱ）胶体钯活化液的研制和应用[J].电镀与精饰,1993(03):25. |
| [14] | Dressick W J;Kondracki L M;Chen M S et al.Characterization of a Collidal Pd(Ⅱ)-Based Catalyst Dispersion for Electroless Metal Deposition[J].Colloids and Surfaces A:Physicochemical and Engineering Aspects,1996(108):101-111. |
| [15] | Liu B;Dai W;Wu G et al.Amorphous Alloy/Ceramic Composite Membrane:Preparation,Characterization and Reaction Studies[J].Catalysis Letters,1997,49:181. |
| [16] | 章兆兰,张涛,姚钟华,张永声.陶瓷表面局部化学镀用活化胶的研究[J].陕西化工,1995(02):29-31. |
| [17] | 刘炳泗;袁维富;王国斌 .无引线瓷介电容局部化学镀镍或铜方法[P].CN:1057300A,1991. |
| [18] | Xia CR.;Li FQ.;Peng DK.;Meng GY.;Guo XX. .Preparation of asymmetric Ni/ceramic composite membrane by electroless plating[J].Colloids and Surfaces, A. Physicochemical and Engineering Aspects,2001(2/3):229-235. |
| [19] | 森英之;熊谷正志 .金属镀覆的前处理剂和使用该前处理剂的金属镀覆方法[P].CN:1262711A,2000. |
| [20] | Osaka T;Takano N;Kurokawa T et al.Fabraction of Electroless NiReP Barrier Layer on SiO2 without Sputtered Seed Layer[J].Electrochemical and Solid-State Letters,2002,5(01):7-10. |
| [21] | 徐丽娜,徐鸿飞,周凯常,徐爱群,岳增全,顾宁,张海黔,刘举正,陈坤基.自组装膜吸附钯的化学镀前活化研究[J].物理化学学报,2002(03):284-288. |
| [22] | Brasch;William R .Copper Colloid and Method of Activating Insulating Surfaces for Subsequent Electroplating[P].US 4762560,1988. |
| [23] | Lindsay Deborah J;Feldstein et al.Activators for colloidal catalysts in electroless plating processes[P].US:4820547,1988. |
| [24] | 袁永明;陈绍谦;谢明贵 等.胶体铜活化液的制备方法[P].CN 1038130A,1989. |
| [25] | 李兵,魏锡文,张朝阳,郑昆.非金属材料化学镀镍活化工艺研究[J].材料保护,2001(02):17-18. |
| [26] | 傅圣利,李义和,王本根,陈占营.玻璃表面无钯活化化学镀镍的研究[J].电镀与精饰,2000(05):10-13. |
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