铜表面修饰硅烷膜在碱性溶液中的耐蚀性能研究

材料保护, 2005, 38(11): 10-13. doi: 10.3969/j.issn.1001-1560.2005.11.003

铜表面修饰硅烷膜在碱性溶液中的耐蚀性能研究

黄令 ^1, , 林克发 ^2, , 杨防祖 ^3, , 许书楷 ^4, , 周绍民 ^5,

1.厦门大学化学化工学院化学系,福建,厦门,361005

2.厦门大学化学化工学院化学系,福建,厦门,361005

3.厦门大学化学化工学院化学系,福建,厦门,361005

4.厦门大学化学化工学院化学系,福建,厦门,361005

5.厦门大学化学化工学院化学系,福建,厦门,361005

基金项目: 福建省自然科学基金(E0210003)

关键词：耐蚀性 , 缓蚀效率 , 3-巯基丙基三甲氧基硅烷 , 自组装膜

Corrosion Resistance of Copper Surface Modified with (3-Mercaptopropyl) Trimethoxysilane in NaOH Solution

为了提高铜的耐蚀性,用自组装技术在铜表面上制备了3-巯基丙基三甲氧基硅烷(MPTS)自组装膜. 利用红外光谱和扫描电子显微镜研究了该膜的结构,运用极化曲线和交流阻抗图谱等电化学方法考察了 MPTS膜在0.5 mol/L NaOH溶液中对铜电极的缓蚀性能.结果表明,MPTS在铜表面可能以化学吸附方式强烈吸附到铜表面, 同时在表面以Si-O-Si键自我交联形成了线性低聚物, MPTS浓度越高, 其膜更致密.与裸铜电极相比,经MPTS修饰后的铜的腐蚀电位正移200 mV, 腐蚀电流降低一个数量级,其缓蚀效率为86.5%.

参考文献

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铜表面修饰硅烷膜在碱性溶液中的耐蚀性能研究

Corrosion Resistance of Copper Surface Modified with (3-Mercaptopropyl) Trimethoxysilane in NaOH Solution

参考文献