欢迎登录材料期刊网

材料期刊网

高级检索

针对近年来电镀镍铬合金的研究概况以及存在的主要问题,阐述了Cr3+配位化学的特点,即Cr3+配位化合物在热力学上的稳定性和动力学上的惰性对镀液的影响.分析了镀液中溶剂、主盐、配位剂、缓冲剂、导电盐和表面活性剂等组分的作用及如何选择恰当的比例.介绍了电流密度、pH值、温度和搅拌等工艺参数对镀层成分和质量的影响.论述了镍铬合金镀中的阳极和阴极过程,探讨了在阳极过程中生成的氯气和在阴极过程中生成的Cr2+对沉积过程的作用.最后,介绍了镍铬合金镀层的组织及热处理对镀层性能的影响.

参考文献

[1] 周绍民.金属电沉积-原理与研究方法[M].上海:上海科学技术出版社,1987
[2] 曹经倩.镍铬合金共沉积的电化学研究[J].材料保护,1993(01):11.
[3] 陈磊;龚竹青.电沉积镍铬合金的研究[J].电镀与精饰,1998(04):4-6.
[4] 张丕俭.Ni-Cr合金镀液中镍铬含量的快速测定[J].材料保护,1999(05):16.
[5] 马正青,黎文献,周世光.电沉积铁镍铬合金工艺参数对镀层铬含量的影响[J].材料保护,2000(06):8.
[6] 张丕俭.影响镍-铬合金电镀层中铬含量的因素[J].材料保护,1997(09):22.
[7] 张丕俭;邹力壮 .电沉积Ni-Cr合金工艺[J].材料保护,1997,30(03):16-18.
[8] Stunzi H;Marty W.Early Stages of the Hydrolysis of Chromium (Ⅲ) in Aqueous.1.Characterization of a Tetrameric Species[J].Inorganic Chemistry,1983(22):2145-2150.
[9] Thompson M;Connick R E.Hydrolytic Polymerization of Chromium (Ⅲ).1.Two Dimeric Species[J].Inorganic Chemistry,1981(20):2279-2285.
[10] Laswick J A;Plane R A .Hydrolytic Polymerization in Boiled Chromic Solutions[J].Journal of the American Chemical Society,1959,81(13):2564-2567.
[11] Ardon M;Plane R A .The Formation of a Dinuclear Cr (Ⅲ) Species by Oxidation of Chromous Solutions[J].Journal of the American Chemical Society,1959,81(13):3197-3200.
[12] Chisholm U;Carnegie R J G .The electrodeposition of ternary iron-chromium-nickel alloys--A critical review[J].Electrodeposition and Surface Treatment,1973,5(01):367-394.
[13] Vrtes A;Watson A;Chisholm C U .A comparative study of Mssbauer spectroscopy and X-ray diffraction for the elucidation of the microstructure of electrodeposited Fe-Cr-Ni alloys[J].Electrochimica Acta,1987,32(12):1761-1767.
[14] El-Sharif M R;Ma S;Chisholm C U .Environment-tally Acceptable Process for Electrodeposition of Hard Chromium from Chromium (Ⅲ) Electrolyte[J].Transactions of the Institute of Metal Finishing,1995,73:19-25.
[15] Barnes C;Ward J B;House J R .Development of a Wholly Aqueous,Wholly Inorganic Trivalent Chromium Plating Process[J].Transactions of the Institute of Metal Finishing,1977,55:73-77.
[16] Ward J B;Christie I R A .The Electrodeposition of Chromium from Trivalent Salts[J].Transactions of the Institute of Metal Finishing,1971,49:148-152.
[17] Chisholm C U;Carnegie R J G .Deposition of Ternary Nickel-Chromium-Iron Alloys from Aqueous Electrolytes:Review and Experimental Studies[J].Plating and Surface Finishing,1972,59:28-37.
[18] Perrin M;Pouillen P;Mousset G et al.Reduction electrochimique des cations complexes formes par dissolution dans le N,N-dimethylformamide des sels de chrome du type CrX3,6H2O (X = Cl,Br,ClO4)[J].Electrochimica Acta,1979,24(01):73-78.
[19] Chisholm U;Watson G .Factors affecting chromium-nickel alloys deposited from a methanol-dimethylformamide bath[J].Electrodeposition and Surface Treatment,1974,5(02):381-393.
[20] Barnes C;Ward J B B;House J R .Development of a Wholly Aqueous,Wholly Inorganic Trivalent Chromium Plating Process[J].Transactions of the Institute of Metal Finishing,1977,55:73-77.
[21] Ward J B;Christie I R A .The Electrodeposition of Chromium from Trivalent Salts[J].Transactions of the Institute of Metal Finishing,1971,49:148-152.
[22] Popov B N;Li W;White R E.A Study of the Stability of Ni-Cr-P Plating Solutions[J].Plating and Surface Finishing,1992(11):72-77.
[23] Watson A;Chisholm C U;El-sharif M R .The role of chromium Ⅱand Ⅵ in the electrodeposition of chromium nickel alloys from trivalent chromium-amide electrolytes[J].Transactions of the Institute of Metal Finishing,1986,64(04):149-153.
[24] Faxel R E Jr;White R E.Ni-Cr-P Plating Bath Characterization by Ion Chromatography[J].Plating and Surface Finishing,1991(09):76-81.
[25] Ibrahim S K;Watson A;Gawne D T .The role of formic acid and methanol on speciation rate and quality in the electro-deposition of chromium from trivalent electrolytes[J].Transactions of the Institute of Metal Finishing,1997,75(05):181-188.
[26] Lashmore D S;Weisshaus I;Pratt K.Electrodeposition of nickel-chromium alloys[J].Plating and Surface Finishing,1986(03):48-55.
[27] Lashmore D S .Proecss and Bath for Electroplating Nickel-Chromium alloys[P].US 4461680,1984-07-24.
[28] Chisholm C U;El-sharif M R.Deposition of chromium-nickel alloys from dimethylformamide /water electrolytes[J].Plating and Surface Finishing,1985(08):58-61.
[29] Chang Y C;Chen Y J;Chun L L.Process characterization for nickel-chromium alloy electrodeposition by statistical analysis[J].Journal of Chin Inst Chem Engr,2001(04):351-359.
[30] Chisholm C U;El-sharif M R.Chromium-nickel codeposits from dimethylformanide baths containing 10 percent water[J].Plating and Surface Finishing,1985(10):82-84.
[31] El-sharif M R;Watson A;Chisholm C U .The Sustained Deposition of Thick Coatings of Chromium/nickel and Chromium/nickel/iron Alloys and Their Properties[J].Transactions of the Institute of Metal Finishing,1988,66(01):34-40.
[32] Mcbee C L;Kruger J .Nature of passive films on iron-chromium alloys[J].Electrochimica Acta,1972,17(08):1337-1341.
[33] 冯绍彬.电镀清洁生产工艺[M].北京:化学工业出版社,2005
[34] Gelchinski M;Yahalom J .Pulse Plating of Chromium-Cobalt Alloys Containing a Phase with the A-15 Structure[J].Journal of the Electrochemical Society,1982,129(11):2433-2438.
[35] Lin K L;Ho J K .Electrodeposited Ni-Cr and Ni-Cr-P Alloys[J].Journal of the Electrochemical Society,1992,139(05):1305-1310.
[36] A. Rousseau;P. Benahen .Single-bath electrodeposition of chromium-nickel compositionally modulated multilayers (CMM) from a trivalent chromium bath[J].Plating & Surface Finishing,1999(9):106-110.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%