锡镀层被广泛地用作电子元件、家用器具和食品包装等的防护性镀层.但其在工业大气中很容易腐蚀变色,不仅影响产品外观,还会增加电子元件的接触电阻,降低它的可焊性.评述了锡层变色的原因及产物,介绍了无铬防锡变色工艺、工艺条件对防变色效果的影响以及防锡变色膜的组成、配位形态.
参考文献
| [1] | Anon.Guide to Tinplate[M].London:ITRI Publication No.622,International Tin Research Institute,1978 |
| [2] | 方景礼.电镀添加剂理论与应用[M].北京:国防工业出版社,2006 |
| [3] | Wang Z W;Fang J L.Analysis of the antitarnish film on a tin surface by x-ray photoelectron spectroscopy and Auger electron spectroscopy[J].Analytica Chimica Acta,1990(238):399-403. |
| [4] | Watanabe N B .Passivation of Tin Coating Using Molybdate[P].JP 62057718B,1988. |
| [5] | Azzerri N;Splendorini L;Battiston C et al.Composition of passivation film in the surface[J].Surface Technology,1982,15(03):255. |
| [6] | Wilcox G D .Electropassivation of tin using molybdate[J].Transactions of the Institute of Metal Finishing,1988,66(03):89. |
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