本论文采用热压烧结方法，选择Zn作为烧结助剂，进行了不同W含量的Cu-W烧结体的低温致密化研究。各烧结体在相同的烧结工艺条件下(1123K，20MPa，1h)相对密度均达到97%以上。在此基础上，成功地制备出了整体致密的Cu-W体系梯度材料，其W含量沿厚度方向在0～25%(质量分数)范围内变化。
The densification of Cu-W with different W-content at relatively low temperature was studied with the sintering activitor of Zn by hot-press sintering process. The relative density of all sintered compacts is above 97.0% at the same condition(1123K,20MPa，1h).Cu-W system FGM was successfully fabricated.Along the direction of thickness, the content of W changes from 0 to 25wt%
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