以粒度0.401 μm、纯度为99.5% 的SnO2 ,粒度0.6 μm、纯度为99% 的MnO2和粒度0.12 μm、纯度为99%的Sb2O3为原料,配料后,放在尼龙行星球磨罐中加无水乙醇湿混4 h,烘干后用50 μm筛网筛分,取筛下料在φ20 mm模具中以6 MPa压力成型为2～3 mm薄片,再将薄片做200 MPa冷等静压处理.将处理后的生坯放入硅钼棒炉中于空气气氛下分别在1 300 ℃、1 350 ℃、1 400 ℃、1 420 ℃、1 450 ℃、1 470 ℃、1 500 ℃均保温5 h烧成,随炉冷却至常温.采用排水法测试试样密度,利用SEM和EDX分析微观结构和元素组成,采用四探针法测量电阻率.研究结果表明:MnO2的加入对SnO2基陶瓷的相对密度有很大的提高, 而Sb2O3的加入对SnO2陶瓷的致密化起到抑制的作用,但适量的Sb2O3可显著提高同时含有MnO2和Sb2O3的SnO2陶瓷的导电性能.同时添加MnO2和Sb2O3的试样的相对密度和电阻率与Mn-Sn-O和Sb-Sn-O分别形成的相关固溶体有很大的关系.对试样的相对密度和电阻率结果分析表明,对于SnO2基陶瓷,MnO2的最佳添加量为1.0%,Sb2O3的最佳添加量为0.5%;其烧结温度为1 400 ℃时,其相对密度为95.63%,电阻率为78.37 Ω·cm.
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