综述了化学镀铜的应用领域,化学镀铜工艺的研究进展,简述了化学镀铜机理的研究现状,提出了有待进一步深入研究的问题.
参考文献
| [1] | 胡光辉,连锦明,杨防祖,林昌健.陶瓷基上化学镀铜[J].电镀与涂饰,2001(02):1-4. |
| [2] | 高俊丽.化学沉积法制备高分子复合导电微球[J].电镀与精饰,1998(04):1. |
| [3] | Francis J Nuzzi .Accelerating the Rate of Electroless Copper Plating[J].Plating and Surface Finishing,1998,73(01):52-54. |
| [4] | Honama H;Kobayashi .Electroless Copper Deposition Presence Using Glyoxylic Acid as a Reducing Agent[J].Journal of the Electrochemical Society,1994,141(03):730-733. |
| [5] | Mizumoto S;Nawatune H .Mechanical Properties of Copper Deposits from Electroless Plating Baths Containing Glycine[J].,1986,76(12):48-51. |
| [6] | Kondo K;Shikawa J I .Electroless Copper Plating in the Presence of Excess Triethanol Amine[J].Journal of the Electrochemical Society,1990,137:1859-1860. |
| [7] | 战余英;王德荣 .直接氧化法化学镀铜液的稳定问题[J].电镀与环保,1984,3(03):18. |
| [8] | Ramasubramanian M.;White R.E.;Chen K.S.;Popov B.N. .Mathematical model for electroless copper deposition on planar substrates[J].Journal of the Electrochemical Society,1999(1):111-116. |
| [9] | Wei-Tsu Tseng;Chia-Hsien Lo;Shih-Chin Lee .Electroless Deposition of Cu Thin Films with CuCl_2-HNO_3 Based Chemistry[J].Journal of the Electrochemical Society,2001(5):C327-C332. |
| [10] | Daniel Vitkavage;Milian Paunovic .Maximum Rate of the Cathodic Reaction in Electroless Copper Deposition[J].,1983,73(04):48-50. |
| [11] | Milan Paunovic .Properties and Structure of Electroless Copper[J].Plating and Surface Finishing,1985,75(02):52-54. |
| [12] | 黄树坤;邝少林 .化学镀铜液中铜离子存在的形式[J].电镀与精饰,1987,9(05):9-11. |
| [13] | 张道礼,龚树萍,周东祥.化学镀铜液中铜离子型体分布和络合剂的作用[J].材料保护,2000(04):3-4. |
| [14] | 宋元伟,赵斌.添加剂对化学镀铜层机械性能的影响[J].化学世界,2000(01):13-18. |
| [15] | Nakahara S .Effect of the Type of Substrates on the Ductility and Microstructure of Electroless Copper Dposites[J].Journal of the Electrochemical Society,1993,140:533-536. |
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