利用X射线衍射(XRD)、扫描电镜(SEM)、透射电镜(TEM)技术对铀表面脉冲电镀镍镀层的组织结构进行了研究.结果表明:该镀层晶体结构为面心立方;具有高(200)面择优取向,其相对取向密度为3.44;晶粒大小约45.5nm;镀层细致、具有多晶特性,存在位错、层错、孪晶等缺陷;利用脉冲电镀在铀表面制备纳米镍镀层是可行的.
参考文献
| [1] | DINI J W;Johnson H R .Plating on some difficult-to-plate metal and alloys[J].Plating and Surface Finishing,1981,10:64-69. |
| [2] | DINI J W;Johnson H R;Helms J R .Nickel-plated uranium:bond strength[J].Plating,1974,1:53-56. |
| [3] | Gray A G .Nickel plating uranium[P].U.S. 2894884,1959. |
| [4] | Orman S;Owen L W;Picton G .The corrosion behavior of nickel-plated uranium[J].Corrosion Science,1972,12:35-44. |
| [5] | Carl C K.Nanostructured materials[M].New York: William Andrew Publishing,2002:179-215. |
| [6] | 赵文轩,杨俊琴.铀钛合金上镍／锌组合镀层工艺研究[C].中国核学会核材料会议论文集,1993:17～25. |
| [7] | 王英华.X光衍射技术基础[M].北京:原子能出版社,1993:230-262. |
| [8] | Cziraki A;Fogarassy B;Gerocs I et al.Microstructure and growth of electrodeposited nanocrystalline nickel foils[J].Journal of Materials Science,1994,29:4771-4777. |
| [9] | Chan KC.;Zhu D.;Qu NS. .Quantitative texture analysis in pulse reverse current electroforming of nickel[J].Surface & Coatings Technology,1998(1/2):69-73. |
| [10] | 吴自勤;王兵.薄膜生长[M].北京:科学出版社,2001:59-215. |
| [11] | Amblard J;Epelboin I;Froment M et al.Inhibition and nickel electrocrystallization[J].Journal of Applied Electrochemistry,1979,9:233-242. |
| [12] | Kaja S;Pickering H W;Bitler W R.Effect of pH on the microstructure of nickel electrodeposits:A TEM study[J].Plating and Surface Finishing,1986(01):58-61. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%