离子注入可作为前处理工艺辅助Al2O3陶瓷表面化学镀铜,优化了离子注入后以甲醛为还原剂、酒石酸钾钠为络合剂的碱性化学镀铜的基本配方.探讨了主盐浓度、甲醛、pH值、温度等对沉铜速度和镀层表面粗糙度的影响.研究了注入不同金属对沉铜速度的影响,结果表明注入铜比注入镍的化学镀铜速度快.
参考文献
[1] | Muralidhar GK.;Pogany A.;Sood DK.;Bhansali S. .Electron microscopy studies of ion implanted silicon for seeding electroless copper films[J].Journal of Applied Physics,1998(11 Pt.1):5709-5713. |
[2] | 王晓红 .Ni离子注入辅助Al2O3陶瓷表面化学镀Cu工艺及组织研究[D].徐州:中国矿业大学,2004. |
[3] | Lin JH.;Chiu SY.;Lee TL.;Tsai CM.;Chen PH.;Lin CC.;Feng MS.;Kou CS.;Shih HC.;Tsai YY. .Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2000(0):592-596. |
[4] | 姜晓霞;沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000:314-315. |
[5] | Lin YM.;Yen SC. .Effects of additives and chelating agents on electroless copper plating[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(1/4):116-126. |
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