为了改进现有电子线路图形制作工艺,应用新型激光烧结技术在陶瓷、高分子材料、半导体以及玻璃等基板上根据需要烧结金属和非金属线条、线路以及图像(如人和动物图案), 取得初步研究结果.本技术可用于布线、修复断裂线条和作标记等.这里着重介绍激光烧结技术在陶瓷、高分子等材料上制作钨、铜线条、图形的工艺流程、浆料制作以及金属特性等研究成果.
参考文献
| [1] | 王建,郁祖湛.激光镀技术的研究动态[J].电镀与精饰,1999(03):1-2. |
| [2] | Paul T Anastas.Green Chemistry[M].Washington DC:A.C.S,1996:1-100. |
| [3] | Von R J Guttfeld (IBM) .Laser-enhanced electroplating and maskless pattern generation[J].Applied Physics Letters,1979,35(09):651-653. |
| [4] | Mogyorosi P;Matei T D .Pulsed laser ablative deposition of thin metal films[J].Applied Sueface Science,1989,36:157-163. |
| [5] | Hirsch T J;Miraky R F;Lin C .Selective-area electroless copper plating on polyimide employing laser patterning of a catalytic film[J].Applied Physics Letters,1990,57:1357-1359. |
| [6] | Bauer A;Ganz J;Hesse K et al.Laser-assisted deposition for electronic packaging application[J].Applied Sueface Science,1990,46:113-120. |
| [7] | Zouari I;Lapicque F;Calvo M et al.Laser assisted metal electro-deposition:comprehensive investigation of zinc deposition[J].Chemical Engineering Science,1990,45(08):2427-2467. |
| [8] | Deura laser company.Laser instrument introduction[M].Germany:Deura laser company,1998:1-20. |
| [9] | Lenhart A .Colored marking and lettering with the help of a fiber laser on the basis of TherMark Process[D].Germany:FH-Nuernberg,2002. |
| [10] | Abe F;Osakada K.A study of laser prototyping for direct manufacturing of dies from metallic powders[A].Columbus,1996:923-926. |
| [11] | Sontheimer T .Herstellung von elektrisch leifaehigen schichten auf nichtmetallisch anorganische basismateriallien mittels lasereschichtung[D].Germany:FH-Nuernberg,2002. |
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