为了获得性能良好的蛋白质芯片的固相载体,采用溶胶-凝胶工艺并结合旋转涂布技术在Al基片上沉积硅氧化物薄膜,考察了薄膜的表面形貌、组成、结构以及与基片的结合性能.结果表明:酸性溶胶在Al基片上沉积薄膜容易产生较多较大的裂纹,严重影响薄膜的表面性能;以浓氨水为催化剂获得的碱性溶胶在Al基片上涂膜,干燥过程中产生的内应力较小,获得的SiOx薄膜表面较均匀,虽然仍存在少量裂纹,但较细小.添加少量DMF于碱性溶胶中可获得比表面积大、无裂缝、与基片结合强度较高的均匀非晶态硅氧化物薄膜,有望作为蛋白质芯片的固相载体.
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